Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel;
Median Price
$6.440
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
WireMasters
1+ parts
$7.002
100+ parts
$6.624
1k+ parts
$5.699
10k+ parts
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TTI Europe
$5.347
$2.874
Verical
Nova Conductors
$5.871
Quittner & Schimek s.r.o.
Vyrian
TME
$9.580
$7.450
ACDS - Activité Composants Distribution Service
Kallista Electronics Ltd
LIBRA Elektronik GmbH
Continental Prestige Electronics
$5.754
Netroflash
Eastek
Authorized Procurement Solutions
Argo Parts USA
Advanced Electronics
Heat Shrinks RNF-100-1-1/2-0-SP attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
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Product Change Notification 2024-01-25 (PDF)
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
1N4148
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
Silicon Standard
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
Shanghai Lunsure Electronic Technology
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
LM107H/883C
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
202C611-71-0
TE Connectivity
TE Connectivity's 202C611-71-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min cable entry of 4.8". Ideal for applications requiring protection against extreme temperatures and secure cable insulation up to 0 AWG wire size.
M23053/5-104-4
Defense Logistics Agency
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
204W221-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
S01-04-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
FIT-221-1/2BK016
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
SO96-3-55-22-90-100
TE Connectivity's SO96-3-55-22-90-100 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. It has a max operating temperature of 175°C, diameter of 4.3mm, and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
M23053/5-107-9
HEAT SHRINK TUBE; IEC Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL; MIL Conformity: NO; Assembly Item Name: TAPER SLEEVE;
NB13524001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0;
RNF-100-3/32-2-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
RNF-100-1-1/4-BK-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel;
M83519/2-7
Sumitomo Electric Industries
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE;
TC-CAPS-4005-8
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN;
TMS-SCE-1K-1/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
S02-08-R-93
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Terminal Type: SOLDER;
CY7721-000
TE Connectivity CY7721-000 is a single wall heat shrink made of fluor-elastomer with max operating temp of 200°C and min of -55°C. Ideal for applications requiring protection against extreme temperatures, it accommodates wires up to 0 AWG.
TMS-SCE-3/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0;
222D132-3-60/42-0
TE Connectivity's 222D132-3-60/42-0 is a heat shrink with SEMI-RIGID POLYOLEFIN jacket material. It has a min cable entry of 0.26 inch and can withstand temperatures from -55 to 135 °C. Ideal for applications requiring protection and insulation of cables up to 0 AWG size.
RT-375-3/4-X-STK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED FLUOROPOLYMER; Construction: SINGLE WALL;
M23053/5-102-0
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
202K132-3/86-0
TE Connectivity's 202K132-3/86-0 heat shrink features semi-rigid polyolefin jacket material. With a min cable entry of 5.9", it can handle temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation, accommodating up to 0 AWG wire size with a max cable entry of 15".
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
RNF-100-1/16-0-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Additional Features: APPROVAL: VDE; Wire Gauge (AWG): 0;
RNF-100-1-1/2-BK-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
RNF-100-1/16-0-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
RNF-100-1/8-0-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
RNF-100-1/4-0-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE;
RNF-100-3/32-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
RNF-100-3/4-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
RNF-100-1-WH-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
RNF-100-1/2-0-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0;
RNF-100-3/4-0-FSP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
RNF-100-1/2-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
RNF-100-3/32-0-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
RNF-100-2-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
RNF-100-3/8-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
RNF-100-3/8-X-SP
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
RNF-100-3/16-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
RNF-100-1/4-BK-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
RNF-100-1/4-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
RNF-100-1/8-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0;
RNF-100-3/16-0-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
Supply Digital Components
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Quantity
12,000 In-Stock
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