Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel;
Median Price
$3.240
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11
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1k+
DigiKey
1+ parts
$493.330
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Master Electronics
$4.742
$2.482
Verical
$3.230
$2.070
Powell Electronics
$3.250
$2.080
TTI Europe
$2.028
$1.930
TTI
$1.970
$1.880
Nova Conductors
$2.493
TME
$1.990
$1.740
Vyrian
Electro Sonic
$3.330
$2.120
IBS Electronics
$3.632
$2.314
Authorized Procurement Solutions
Heat Shrinks NB16024001 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT2222ALT1G
Onsemi
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
261
Deltrol Controls
Other Relays;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
LL4148
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
LM555CMX
Texas Instruments
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
06035C103KAT2A
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CWT-9-W122-5
TE Connectivity
TE Connectivity's CWT-9-W122-5 heat shrink features single wall construction with crosslinked modified polyolefin jacket material. It has a max operating temperature of 125°C, suitable for 16 AWG wire gauge applications. With a diameter of 1.5mm, it is ideal for protecting and insulating wires in various electronic and electrical systems.
202K132-3/86-0
TE Connectivity's 202K132-3/86-0 heat shrink features semi-rigid polyolefin jacket material. With a min cable entry of 5.9", it can handle temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation, accommodating up to 0 AWG wire size with a max cable entry of 15".
S02-03-RCS453
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
TFER-1/4-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYTETRAFLUOROETHYLENE;
FIT-221-1/4CL005
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
RNF-100-3/32-CL-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
M83519/2-2
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
DR-25-TW-1/2-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: ELASTOMER;
M83519/2-9
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
NB12042001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel;
975269-000
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel;
RPS-1K-18-12/2.0-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0;
RNF-3000-12/4-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0;
RNF-100-3/8-2-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
DR-25-TW-3/4-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
M23053/5-106-0
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
M23053/5-105-0
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
FIT221-3/16-BLK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
202K142-4/180-0
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN;
RNF-100-3/8-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NB16104001
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel;
NB16614001
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel;
NB16412001
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel;
NB16404001
HEAT SHRINK TUBE; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel;
NB16204001
NB16934001
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
NB16502001
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG;
NB16964001
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
NB16072001
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: CROSSLINKED FLUOROPOLYMER;
NB16042001
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
NB16622001
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
NB16092001
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER;
NB16034001
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel;
NB16064001
NB16004001
NB16012001
NB16054001
NB16112001
NB16924001
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
NB16084001
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
Supply Digital Components
$106.00
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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