Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
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Vyrian
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$7.500
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$7.275
Continental Prestige Electronics
Argo Parts USA
Bastille Electronics
Heat Shrinks LSTT-12.7-0-25MM attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BAV99-7-F
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
M23053/5-108-9
Brady
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
ATUM-8/2-0-STK
Commscope
HEAT SHRINK TUBE; Construction: MEDIUM WALL; Jacket Material: POLYOLEFIN;
CWT-5-W122-5
TE Connectivity
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL;
204473-000
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
ATUM-12/4-0-SP
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
NB20034001
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
RNF-100-3/8-2-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
RW-200-7/8-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 200 Cel; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
M23053/16-006-0
Ls Cable & System
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; Jacket Material: ELASTOMER POLYOLEFIN; Construction: SINGLE WALL; IEC Conformity: NO; DIN Conformity: NO;
S02-07-R-92
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 2.65 mm; Maximum Wire Size: 0 AWG;
RNF-100-1/8-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0;
FIT-221-3/16CL002
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
HT-SCE-1K-1-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 225 Cel; Minimum Operating Temperature: -55 Cel;
222A111-25-00/86-0
HEAT SHRINK BOOT; Material: ELASTOMER; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
222K132-25/225-0
TE Connectivity's 222K132-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 5.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size, with a max cable entry of 15".
562A011-3/42-0
TE Connectivity's 562A011-3/42-0 heat shrink features dual wall construction with polyolefin jacket material. With a temperature range of -55 to 135°C, it accommodates wires up to 0 AWG. Ideal for electrical insulation and protection in various applications.
222K121-25-0
TE Connectivity's 222K121-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 5.6". Ideal for applications requiring -75°C to 150°C temp range, accommodating up to 0 AWG wire size with max cable entry of 14".
RNF-100-3/8-WH-STKCS5004
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL;
S01-04-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
588742-000
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 24; Diameter: 5.95 mm; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LSTT-12.7-0-GS4/6-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 125 Cel;
LSTT-12.7-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
LSTT-12.7-0-100MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 125 Cel;
LSTT-12.7-0-180MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
LSTT-12.7-0-40MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
LSTT-12.7-0-50MM
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
LSTT-12.7-0-55MM
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel;
LSTT-12.7-9-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL;
LSTT-12.7-4-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
LSTT-19-0-50MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
LSTT-12.7-6-SP
LSTT-19-4-SP
LSTT-12.7-X-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
LSTT-12.7-2-30MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
LSTT-12.7-2-50MM
LSTT-12.7-2-100MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL;
LSTT-12.7-6-40MM
LSTT-12.7-2-SP
LSTT-12.7-2-35MM
LSTT-19-0-100MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
Supply Digital Components
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12,000 In-Stock
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