Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
Median Price
$15.751
Lifecycle Status
Suppliers In-Stock
14
In-Stock Inventory
1k+
TTI
1+ parts
$14.860
100+ parts
$10.850
1k+ parts
-
10k+ parts
Interstate Connecting
$12.825
$12.469
Mouser Electronics
$19.360
$12.570
$12.100
DigiKey
$21.190
$14.559
Verical
$14.786
$12.177
$10.437
Arrow
$7.512
PEI Genesis
Powell Electronics
$18.650
Chip1Stop
Electro Sonic
$20.300
$16.010
$12.820
Vyrian
IBS Electronics
$20.799
Nova Conductors
Kallista Electronics Ltd
Perfect Parts
Continental Prestige Electronics
Argo Parts USA
Aranea Global
Heat Shrinks DWP-125-1-0-STK attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
PCN Assembly/Origin - Mult Devs Leadtime update 08/APR/2020
PCN Packaging - Mult Devs packaging 03/APR/2020 Mult Devs packaging chg 03/APR/2020
PCN Other - DWP-125 Additional Suppliers 12/Jun/2015
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
BAV99WT1G
Onsemi
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
Excel (Suzhou) Semiconductor
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
Goodwork Semiconductor
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
2N2222A
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Mde Semiconductor
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Telefunken Microelectronics
Multicomp Pro
222D132-3-60/42-0
TE Connectivity
TE Connectivity's 222D132-3-60/42-0 is a heat shrink with SEMI-RIGID POLYOLEFIN jacket material. It has a min cable entry of 0.26 inch and can withstand temperatures from -55 to 135 °C. Ideal for applications requiring protection and insulation of cables up to 0 AWG size.
RNF-100-1/16-0-90MM
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
TMS-SCE-1K-3/8-2.0-4
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
M23053/4-301-0
Defense Logistics Agency
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
RMW-63/19-1200/ADH-0
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel;
TMS-SCE-1K-3/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
M23053/8-002C
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
TAT-125-1/2-0-STK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: DUAL WALL;
M23053/5-109-9
Grayline
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; DIN Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO;
DR-25-1/8-0-SP-
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED ELASTOMER;
B-155-9003
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
S01-03-RCS918
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
S02-08-R-91
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG;
M83519/2-16
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
202K163-25/225-0
TE Connectivity's 202K163-25/225-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and accommodates up to 0 AWG wire. Ideal for applications requiring a min cable entry of 9.9 inches and max of 23 inches.
462A034-100-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
202A153-25-0
TE Connectivity's 202A153-25-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temperature range, and accommodates wire sizes up to 0 AWG. Ideal for applications requiring a 0.339" to 1.031" cable entry such as electrical insulation and protection in various industries.
FIT-321-1-1/2BK105
Alpha Wire
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: POLYOLEFIN;
RPS-8-4/2.0-S1-4
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG;
222K132-25L-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 5.9 inch; Minimum Operating Temperature: -75 Cel; Maximum Cable Entry: 15 inch;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DWP-125-1/4-0-STK
DWP-125-1/2-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
DWP-125-3/8-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
DWP-125-3/16-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -40 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
DWP-125-1/8-5-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
DWP-125-1/4-0-0.30IN-T.031
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -40 Cel;
DWP-125-1/4-2-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 110 Cel;
DWP-125-1/4-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
DWP-125-1-0-2IN
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL;
DWP-125-1/2-2-30MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL;
DWP-125-1-0-40MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel;
DWP-125-1-0-120MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG;
DWP-125-1-0-100MM
DWP-125-1/4-0-16MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG;
DWP-125-1/2-2-50MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Construction: DUAL WALL;
DWP-125-1-0-1.5IN
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
DWP-125-1-0-76MM
DWP-125-1-0-70MM
DWP-125-1-0-150MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
DWP-125-1-9-2IN
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -40 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 110 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved