Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
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$10.570
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$8.880
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$12.819
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Mouser Electronics
$15.400
$9.160
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$17.050
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Element14
$18.840
$15.210
Master Electronics
$8.550
$8.330
Verical
$10.059
DigiKey
$48.253
$45.415
Chip1Stop
$10.300
Powell Electronics
$9.070
$7.930
Nova Conductors
$7.580
VNN
Vyrian
Electro Sonic
$7.610
$6.100
IBS Electronics
$8.512
$7.450
Netroflash
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Heat Shrinks BSTS-04X4 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
PCN Design/Specification - Multiple Devices New Component Supplier 30/Apr/2015
PCN Assembly/Origin - Mult Devs Leadtime update 08/APR/2020
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STM32H753IIT6
STMicroelectronics
STM32H753IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via CAN, ETHERNET, USB, and more.
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
PIC18F4550-I/ML
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BAV99
National Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
HTAT-24/6-0-STK
TE Connectivity
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0;
RNF-100-3/16-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
202K232-25-01/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG;
FIT-221-3/16GR002
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: CSA; UL;
TMS-SCE-1K-2-1/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
RNF-100-3/8-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
RNF-100-1/8-4-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
M23053/5-105-9
Grayline
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; MIL Conformity: NO; Construction: SINGLE WALL; IEC Conformity: NO;
322A112-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Construction: DUAL WALL;
D-1744-01-LF
HEAT SHRINK SOLDER SLEEVE; Minimum Operating Temperature: -55 Cel; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel;
202K174-100/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
SO63-2-9030
TE Connectivity's SO63-2-9030 heat shrink features a single wall construction with crosslinked modified PVDF jacket material. With a max operating temp of 150°C, it has a diameter of 2.65mm and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
222D132-3-60/42-0
TE Connectivity's 222D132-3-60/42-0 is a heat shrink with SEMI-RIGID POLYOLEFIN jacket material. It has a min cable entry of 0.26 inch and can withstand temperatures from -55 to 135 °C. Ideal for applications requiring protection and insulation of cables up to 0 AWG size.
RT-375-3/4-X-STK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED FLUOROPOLYMER; Construction: SINGLE WALL;
DR-25-1/8-0
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
ATUM-8/2-0-STK
Commscope
HEAT SHRINK TUBE; Construction: MEDIUM WALL; Jacket Material: POLYOLEFIN;
RT-375-3/8-X-50MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
M23053/5-108-0
Defense Logistics Agency
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
CGPT-38/19-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
222A111-3-0
TE Connectivity's 222A111-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min cable entry of 3.8". Ideal for applications requiring protection against extreme temperatures and insulation for cables up to 0 AWG size.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BSTS-07X4
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel;
BSTS-17X4
HEAT SHRINK TUBE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel;
BSTS-11X25-CL/NM
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
BSTS-11X25/NM
HEAT SHRINK TUBE; Maximum Operating Temperature: 90 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
BSTS-04-X25FR/NM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
BSTS-27X4
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
BSTS-45X4
HEAT SHRINK TUBE; Construction: SINGLE WALL;
BSTS-04-X25FR
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: DUAL WALL;
BSTS-15X4
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
BSTS-30X25/CL
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel;
BSTS-03-X4FR
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED POLYOLEFIN;
BSTS-04-X4FR
HEAT SHRINK TUBE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 110 Cel;
BSTS-15-CL-7.25IN
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
BSTS-07-2.5IN/FR/NM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Construction: SINGLE WALL;
BSTS-17X4/CL
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0;
BSTS-17X25FR/RED/NM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Additional Features: REFERENCE STANDARD: ASTM; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
BSTS-13X25/NM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
BSTS-03X25
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
BSTS-07X100FR
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Additional Features: REFERENCE STANDARD: ASTM; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
BSTS-04X4/NM
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
Supply Digital Components
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