Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 222F211-71/86-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, -55 to 135°C temp range, and 0.26" to 0.614" cable entry. Ideal for applications requiring durable insulation and protection for cables up to 0 AWG in size.
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Master Electronics
$11.510
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$16.207
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$12.285
$12.040
AZTECH Wire
$15.380
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$16.777
Argo Parts USA
Semi-rigid polyolefin provides excellent abrasion resistance and durability, making this heat shrink suitable for a wide range of applications.
The minimum cable entry size allows for flexibility in usage, accommodating various cable sizes for different projects.
With a high maximum operating temperature, this heat shrink can withstand elevated heat levels without compromising performance, making it reliable under extreme conditions.
The low minimum operating temperature ensures that the heat shrink remains functional even in cold environments, providing consistent protection for cables.
Designed to accommodate larger wire sizes, this heat shrink is suitable for heavy-duty applications where thicker wires are used.
The large maximum cable entry size offers versatility in installations, allowing for easy application on various cable sizes and types.
Polyolefin is known for its electrical insulation properties and chemical resistance, making it a dependable material choice for protecting and insulating cables.
Heat Shrinks 222F211-71/86-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Maximum Cable Entry:
Minimum Cable Entry:
Connector Accessory Type:
Jacket Material:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
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TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
EU2B-YS3203C
Idec
ROTARY SWITCH;
Changzhou Starsea Electronics
1N4148W-7-F
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
Panjit International
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
SCL-1/2-0-STK
TE Connectivity
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
M83519/2-4
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
B-040-22-N
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
M83519/2-2
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
M23053/8-003-C
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
775210-000
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL;
RNF-100-3/8-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN;
FIT-221-1/4BK020
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
CWT-3809-W2
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 22 AWG; Wire Gauge (AWG): 22;
108-2
Hellermanntyton
HEAT SHRINK BOOT; Jacket Material: FLUORO-ELASTOMER; Construction: DUAL WALL;
ATUM-52/13-0-SP
HEAT SHRINK TUBE ; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
RW-175-3/64-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED FLUOROPOLYMER; Wire Gauge (AWG): 0;
RNF-100-1/8-BK-STK-CS7250
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
202A111-3-0
TE Connectivity's 202A111-3-0 heat shrink features POLYOLEFIN jacket material, 0.15" min cable entry, and -55 to 135°C operating temp range. Ideal for applications requiring protection and insulation of cables with up to 0 AWG wire size.
342A012-25-G05/225-0
HEAT SHRINK 2-WAY JUNCTION; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER;
202K121-100-01/180-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 105 Cel; Maximum Cable Entry: 14 inch; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 5.6 inch; Minimum Operating Temperature: -30 Cel;
D-1744-01-LF
HEAT SHRINK SOLDER SLEEVE; Minimum Operating Temperature: -55 Cel; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel;
RNF-100-1/4-0-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE;
CWT-9001
TE Connectivity's CWT-9001 heat shrink features single wall construction with crosslinked modified polyolefin jacket material. It supports wire gauge 18 AWG, suitable for discrete wire applications. Operating temperature ranges from -55 to 125°C, accommodating wires b/w 22 and 18 AWG efficiently.
RNF-100-1/8-CL-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
222F242-71-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Cable Entry: 1.13 inch; Minimum Cable Entry: .402 inch; Maximum Wire Size: 0 AWG;
222F211-51/164-0
HEAT SHRINK BOOT; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
222F274-71-0
HEAT SHRINK BOOT; Minimum Cable Entry: .591 inch; Minimum Operating Temperature: -55 Cel; Maximum Cable Entry: 1.791 inch; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
222F211-71/42-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
222F232-71-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Cable Entry: .961 inch; Minimum Operating Temperature: -55 Cel;
222F232-71/42-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Cable Entry: .35 inch; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Cable Entry: .961 inch; Material: POLYOLEFIN;
222F253-71-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Cable Entry: .429 inch; Maximum Wire Size: 0 AWG;
222F263-71-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 1.512 inch; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Minimum Cable Entry: .5 inch;
222F242-71/180-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN;
222F285-71-0
HEAT SHRINK BOOT; Minimum Cable Entry: .689 inch; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Cable Entry: 1.858 inch; Material: POLYOLEFIN;
222F253-71/86-0
HEAT SHRINK BOOT; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Cable Entry: .429 inch;
222F242-71/86-0
HEAT SHRINK BOOT; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Cable Entry: .402 inch; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
222F211-50-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Minimum Cable Entry: .26 inch; Maximum Wire Size: 0 AWG; Maximum Cable Entry: .614 inch; Minimum Operating Temperature: -55 Cel;
222F221-71/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Cable Entry: .299 inch; Material: POLYOLEFIN; Maximum Cable Entry: .689 inch; Minimum Operating Temperature: -55 Cel;
222F221-71/42-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Cable Entry: .689 inch; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Cable Entry: .299 inch;
222F211-51-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Minimum Cable Entry: .26 inch; Maximum Cable Entry: .614 inch;
222F211-71-0
HEAT SHRINK BOOT; Maximum Cable Entry: .614 inch; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
222F221-71-0
HEAT SHRINK BOOT; Maximum Cable Entry: .689 inch; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Cable Entry: .299 inch; Material: POLYOLEFIN;
222F274-71-35-0
HEAT SHRINK BOOT; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
222F242-71/42-0
HEAT SHRINK BOOT; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
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