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NRM6045T470MMRRV

Taiyo Yuden

NRM6045T470MMRRV by Taiyo Yuden

GENERAL PURPOSE INDUCTOR; Inductor Application: POWER INDUCTOR; No. of Terminals: 2; Package Style (Meter): SMT; Shielded: NO; Surface Mount: YES;

Median Price

$0.282

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Dan-Mar Components

USA . 2,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,490

-

-

-

-

Bristol Electronics

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$0.282

1k+ parts

$0.139

10k+ parts

$0.122

1,500

-

$0.282

$0.139

$0.122

Technical Specifications

Fixed Inductors NRM6045T470MMRRV attributes and parameters. Explore more Fixed Inductors devices from Taiyo Yuden

Inductor Specifications

Inductor Type:

Inductor Application:

Nominal Inductance:

47 μH

Maximum Rated Current:

1.2 A

DC Resistance:

272 mΩ

Tolerance:

20 %

No. of Functions:

1

Self Resonance Frequency:

6 MHz

Test Frequency:

100 kHz

Physical Characteristics

Package Shape:

Rectangular Package

Case or Size Code:

2424

Shielded:

No

Construction:

Rectangular

Core Material:

Ferrite

Surface Mounted:

Yes

Thermal Characteristics

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Terminal Characteristics

Terminal Position:

Dual Ended

Terminal Shape:

One Surface

No. of Terminals:

2

Packaging & Delivery

Package Style:

SMT

Package Length:

0.236 in (6 mm)

Package Height:

0.177 in (4.5 mm)

Package Width:

0.236 in (6 mm)

Packing Method:

Tape and Reel, Embossed, 13 in

Standards

Reference Standard:

AEC-Q200

Trade Compliance

NRM6045T470MMRRV Inductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Taiyo Yuden

Taiyo Yuden Co., Ltd. engages in manufacture and sale of electronic components. Its products include ceramic capacitors, inductors, noise suppression components, multilayer ceramic devices, chip antennas, and wireless modules. The company was founded by Hikohachi Sato on March 23, 1950 and is headquartered in Tokyo, Japan.

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