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RR0816P-113-D

Susumu

RR0816P-113-D by Susumu

FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 11000 ohm; Rated Power Dissipation (P): .0625 W; Maximum Operating Temperature: 125 Cel; Tolerance: .5 %;

Median Price

$0.094

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 145,146 parts In-Stock

1+ parts

$0.100

100+ parts

$0.022

1k+ parts

$0.018

10k+ parts

$0.017

145,146

$0.100

$0.022

$0.018

$0.017

Mouser Electronics

USA . 9,763 parts In-Stock

1+ parts

$0.100

100+ parts

$0.021

1k+ parts

$0.018

10k+ parts

$0.014

9,763

$0.100

$0.021

$0.018

$0.014

Element14

Singapore . 4,331 parts In-Stock

1+ parts

$0.508

100+ parts

$0.169

1k+ parts

$0.103

10k+ parts

$0.099

4,331

$0.508

$0.169

$0.103

$0.099

Verical

USA . 35,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.023

35,974

-

-

-

$0.023

Chip1Stop

Japan . 22,874 parts In-Stock

1+ parts

-

100+ parts

$0.021

1k+ parts

$0.013

10k+ parts

$0.011

22,874

-

$0.021

$0.013

$0.011

Farnell

UK . 4,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.088

4,081

-

-

-

$0.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Forefront Electronics and Design

USA . 2,500 parts In-Stock

1+ parts

$0.250

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

$0.250

-

-

-

Component Electronics Inc.

Canada . 3,900 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

10k+ parts

-

3,900

$0.770

$0.580

$0.500

-

Q Components

USA . 8,900 parts In-Stock

1+ parts

-

100+ parts

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8,900

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-

-

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Prism Electronics

USA . 27 parts In-Stock

1+ parts

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27

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,754 parts In-Stock

1+ parts

$0.122

100+ parts

$0.040

1k+ parts

-

10k+ parts

-

4,754

$0.122

$0.040

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,827 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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16,827

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Perfect Parts

USA . 10,976 parts In-Stock

1+ parts

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10k+ parts

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10,976

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Technical Specifications

Fixed Resistors RR0816P-113-D attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

PRECISION

Construction:

Rectangular

JESD-609 Code:

e3

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.4 mm

Length (Package):

1.6 mm

Package Style (Meter):

SMT

Width (Package):

.8 mm

Packing Method:

TR, PAPER, 7 INCH

Rated Power Dissipation (P):

Resistance:

Resistor Type:

Size Code:

0603

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

75 V

Trade Compliance

RR0816P-113-D Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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