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RP1608S-R36-F

Susumu

RP1608S-R36-F by Susumu

FIXED RESISTOR; Resistance: .36 ohm; Rated Power Dissipation (P): .2 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %; Package Style (Meter): SMT;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Fixed Resistors RP1608S-R36-F attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Construction:

Chip

JESD-609 Code:

e3

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-40 Cel

Height (Package):

.4 mm

Length (Package):

1.6 mm

Package Style (Meter):

SMT

Width (Package):

.8 mm

Packing Method:

TR

Rated Power Dissipation (P):

Resistance:

Resistor Type:

Series:

RP1608

Size Code:

0603

Sub-Category:

Fixed Resistors

Technology:

METAL FILM

Temperature Coef (ppm/Cel):

0,200

Terminal Finish:

Matte Tin (Sn)

Tolerance:

1 %

Trade Compliance

RP1608S-R36-F Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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