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RG1608P-470-P-T1

Susumu

RG1608P-470-P-T1 by Susumu

PTC RESETTABLE FUSE; Mounting Type: SURFACE MOUNT; Maximum Operating Temperature: 155 Cel; Tolerance: .02 %; Manufacturer Series: RG; Packing Method: TR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Non-linear Resistors RG1608P-470-P-T1 attributes and parameters. Explore more Non-linear Resistors devices from Susumu

Specs

JESD-609 Code:

e3

Manufacturer Series:

RG

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Shape (Package):

RECTANGULAR PACKAGE

Packing Method:

TR

Rated AC Voltage (URac):

75 V

Rated Temperature:

155 Cel

Resistor Type:

Sub-Category:

Non-linear Resistors

Terminal Finish:

MATTE TIN

Terminal Placement:

DEND

Terminal Shape:

WRAPAROUND

Thermistor Application:

TEMPERATURE SENSING

Tolerance:

Trade Compliance

RG1608P-470-P-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.40.80.70

SB

8533.40.00.80

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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