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RG1005N-7320-C-T10

Susumu

RG1005N-7320-C-T10 by Susumu

The Susumu RG1005N-7320-C-T10 is a chip resistor with a resistance of 732 ohm and a tolerance of 0.25%. It is suitable for applications requiring a fixed resistor in SMT package style, with an operating voltage of 75V and max temperature of 155°C.

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Vyrian

USA . 2,428 parts In-Stock

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Nova Conductors

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Semicontronic

India . 275 parts In-Stock

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275

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Aztec Data Supply Inc.

USA . 126 parts In-Stock

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$0.390

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Corohmni

South Africa . 228 parts In-Stock

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AZTECH Wire

Italy . 358 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the RG1005N-7320-C-T10, an exceptional fixed resistor by Susumu that offers outstanding quality and unrivaled performance. With its advanced thin film technology and chip construction, this resistor is built to last. Its compact size code of 0402 makes it suitable for various applications. The RG1005N-7320-C-T10 boasts a resistance of 732 ohm and operates at a wide temperature range of -55 to 155 °C. With a tolerance of only 0.25%, customers can rely on its accuracy. Whether you need it for automotive, industrial, or consumer electronics, this resistor guarantees exceptional value, reliability, and precision. Trust Susumu, a trusted manufacturer known for delivering top-notch products that meet AEC-Q200 standards. Experience the benefits of the RG1005N-7320-C-T10 today and elevate your projects to new heights.

Feature Benefit Bullets

Technology: THIN FILM

Thin film technology provides high precision and stability in resistor values, making this product suitable for applications requiring accuracy.

Resistance: 732 ohm

With a specific resistance value, this resistor can be used for precise resistance matching or setting in circuits.

Maximum Operating Temperature: 155 °C

The high maximum operating temperature allows this resistor to be used in various environments without the risk of overheating or degradation.

Tolerance: 0.25 %

With a low tolerance level, this resistor provides accurate and consistent performance in circuit applications.

Rated Power Dissipation (P): 0.125 W

This resistor can handle a power dissipation of 0.125 W, making it suitable for low power applications where efficiency is crucial.

Technical Specifications

Fixed Resistors RG1005N-7320-C-T10 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Construction:

Chip

JESD-609 Code:

e3

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.35 mm

Length (Package):

1 mm

Package Style (Meter):

SMT

Width (Package):

.5 mm

Packing Method:

Tape, Embossed

Rated Power Dissipation (P):

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Series:

RG

Size Code:

0402

Sub-Category:

FIXED RESISTOR

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

10

Terminal Finish:

Matte Tin (Sn)

Tolerance:

Operating Voltage:

75 V

Trade Compliance

RG1005N-7320-C-T10 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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