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PCMC063TR68MN

Susumu

PCMC063TR68MN by Susumu

GENERAL PURPOSE INDUCTOR; Inductor Application: POWER INDUCTOR; No. of Terminals: 2; Package Style (Meter): SMT; Shielded: NO; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SPM Sales

USA . 885 parts In-Stock

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885

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ComSIT Distribution GmbH

Germany . 781 parts In-Stock

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781

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Assy Fe

Spain . 1,347 parts In-Stock

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1,347

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Technical Specifications

Fixed Inductors PCMC063TR68MN attributes and parameters. Explore more Fixed Inductors devices from Susumu

Inductor Specifications

Inductor Type:

Inductor Application:

Nominal Inductance:

680 nH

Maximum Rated Current:

15.5 A

DC Resistance:

5.5 mΩ

Tolerance:

20 %

No. of Functions:

1

Series:

PCMC063T

Physical Characteristics

Package Shape:

Rectangular Package

Case or Size Code:

2926

Shielded:

No

Construction:

Choke Coil

Surface Mounted:

Yes

Terminal Characteristics

Terminal Position:

Dual Ended

Terminal Shape:

Wraparound

Terminal Finish:

Matte Tin

No. of Terminals:

2

Packaging & Delivery

Package Style:

SMT

Package Length:

0.287 in (7.3 mm)

Package Height:

0.118 in (3 mm)

Package Width:

0.26 in (6.6 mm)

Standards

JESD-609 Code:

e3

Trade Compliance

PCMC063TR68MN Inductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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Authentic purchasing experiences

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