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PAT1220-C-5DB-T5

Susumu

PAT1220-C-5DB-T5 by Susumu

FIXED ATTENUATOR; Minimum Operating Temperature: -55 Cel; Terminal Finish: Matte Tin (Sn); Maximum Operating Frequency: 10000 MHz; Maximum Operating Temperature: 125 Cel; Nominal Attenuation: 5 dB;

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 43,384 parts In-Stock

1+ parts

$0.320

100+ parts

$0.234

1k+ parts

$0.203

10k+ parts

$0.176

43,384

$0.320

$0.234

$0.203

$0.176

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Speed Components Ltd

Israel . 500 parts In-Stock

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500

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Cogito LLC

Ukraine . 433 parts In-Stock

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433

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Elcom Components

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Perfect Parts

USA . 109,008 parts In-Stock

1+ parts

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109,008

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Speed Components Ltd (Excess)

Israel . 834 parts In-Stock

1+ parts

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834

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Formix International (Excess)

India . 19 parts In-Stock

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Technical Specifications

RF/Microwave Attenuators PAT1220-C-5DB-T5 attributes and parameters. Explore more RF/Microwave Attenuators devices from Susumu

Specs

Nominal Attenuation:

5 dB

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

20 dBm

JESD-609 Code:

e3

Maximum Operating Frequency:

10000 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

RF or Microwave Device Type:

Terminal Finish:

Matte Tin (Sn)

Maximum Voltage Standing Wave Ratio:

1.3

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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