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KRL3264D-C-R470-F-T1

Susumu

KRL3264D-C-R470-F-T1 by Susumu

Susumu's KRL3264D-C-R470-F-T1 is a 0.47 ohm fixed resistor with 1% tolerance and 3W power dissipation. Featuring metal foil technology, it operates b/w -55 to 175 °C, making it ideal for automotive applications meeting AEC-Q200 standard.

Median Price

$0.247

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$0.247

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29

$0.247

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Vyrian

USA . 4,051 parts In-Stock

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4,051

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.247

100+ parts

$0.242

1k+ parts

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1,000

$0.247

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AZTECH Wire

Italy . 768 parts In-Stock

1+ parts

$15.818

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768

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Overview

Experience superior quality and reliability with the Susumu KRL3264D-C-R470-F-T1 fixed resistor. As a leading manufacturer in the industry, Susumu stands out for its cutting-edge technology and innovative construction, ensuring top-notch performance in a compact package. Ideal for a wide range of applications, this resistor offers precision resistance of 0.47 ohm with a tolerance of just 1%, making it perfect for demanding electronic circuits. Trust Susumu to deliver exceptional value, durability, and efficiency with the KRL3264D-C-R470-F-T1, setting new standards in the world of fixed resistors.

Feature Benefit Bullets

Rated Temperature: 120 °C

Provides a high tolerance for temperature fluctuations, making this resistor suitable for a wide range of applications.

Technology: METAL FOIL

Metal foil technology offers high precision and stability in resistance values, ensuring reliability in circuit performance.

Resistance: 0.47 ohm

Low resistance value allows for efficient current flow and precise control in various electronic circuits.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this resistor can withstand extreme conditions without compromising performance.

Tolerance: 1 %

Provides high accuracy in resistance value, ensuring consistent and reliable performance in electronic circuits.

Rated Power Dissipation (P): 3 W

Capable of dissipating up to 3 watts of power, making it suitable for applications requiring high power handling capacity.

Technical Specifications

Fixed Resistors KRL3264D-C-R470-F-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Construction:

Rectangular

JESD-609 Code:

e3

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.5 mm

Length (Package):

6.3 mm

Package Style (Meter):

SMT

Width (Package):

3.1 mm

Packing Method:

TR, EMBOSSED, 7 INCH

Rated Power Dissipation (P):

3 W

Rated Temperature:

120 Cel

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Size Code:

2512

Technology:

METAL FOIL

Temperature Coef (ppm/Cel):

50

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Shape:

ONE SURFACE

Tolerance:

1 %

Trade Compliance

KRL3264D-C-R470-F-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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