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HRG3216P-2001-B-T1

Susumu

HRG3216P-2001-B-T1 by Susumu

Susumu's HRG3216P-2001-B-T1 is a 2000 ohm SMT fixed resistor with 0.1% tolerance. With a rated power dissipation of 1W, it operates b/w -55 to 155 °C making it ideal for automotive applications meeting AEC-Q200 standards.

Median Price

$0.850

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,236 parts In-Stock

1+ parts

$0.850

100+ parts

$0.585

1k+ parts

$0.439

10k+ parts

$0.428

2,236

$0.850

$0.585

$0.439

$0.428

Mouser Electronics

USA . 1,525 parts In-Stock

1+ parts

$0.850

100+ parts

$0.585

1k+ parts

$0.450

10k+ parts

$0.442

1,525

$0.850

$0.585

$0.450

$0.442

Overview

Experience the quality and reliability of Susumu's HRG3216P-2001-B-T1 fixed resistor, designed to meet the highest standards in the industry. This innovative thin film technology resistor is ideal for a wide range of applications, from automotive to industrial electronics. With a high operating temperature range and excellent performance, this product offers customers unmatched value, precision, and durability. Trust Susumu to provide you with the best solution for your electronic component needs.

Feature Benefit Bullets

Rated Temperature: 70 °C

This resistor can operate efficiently at a temperature range of -55 to 155°C, making it suitable for a wide variety of applications.

Resistance: 2000 ohm

With a specific resistance value of 2000 ohms, this resistor can provide precise and stable performance in electronic circuits.

Tolerance: 0.1%

The low tolerance of 0.1% ensures accurate and reliable resistance values, enhancing the overall performance of the circuit.

Rated Power Dissipation (P): 1 W

With a rated power dissipation of 1 watt, this resistor can handle high power applications without overheating or failure.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and conductivity, ensuring robust connections in the circuit.

Mounting Type: SURFACE MOUNT

The surface mounting type allows for easy and secure installation on PCBs, saving space and facilitating automated assembly.

Technical Specifications

Fixed Resistors HRG3216P-2001-B-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ANTI-SULFUR

Construction:

Rectangular

JESD-609 Code:

e3

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.45 mm

Length (Package):

3.2 mm

Package Style (Meter):

SMT

Width (Package):

1.6 mm

Packing Method:

TR, EMBOSSED, 7 INCH

Rated Power Dissipation (P):

1 W

Rated Temperature:

70 Cel

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Size Code:

1206

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

200 V

Trade Compliance

HRG3216P-2001-B-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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