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Z84C30BD2

STMicroelectronics

Z84C30BD2 by STMicroelectronics

Z84C30BD2 by STMicroelectronics is an 8-bit timer IC with a max clock frequency of 6 MHz. It operates in a temperature range from -55 °C to 125°C and has a supply voltage b/w 4.5V to 5.5V. Ideal for applications requiring multiple timers, it features parallel access and is compatible with Z80C bus technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,316

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-

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Anansix

USA . 1,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,141

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Digiode

USA . 707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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707

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,923 parts In-Stock

1+ parts

$19.370

100+ parts

-

1k+ parts

-

10k+ parts

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2,923

$19.370

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IDEA Electronic Components Group

UK . 544 parts In-Stock

1+ parts

$25.688

100+ parts

-

1k+ parts

$23.119

10k+ parts

-

544

$25.688

-

$23.119

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MKK Technologies

India . 830 parts In-Stock

1+ parts

$48.305

100+ parts

-

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830

$48.305

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DigiPath Technology Company

USA . 830 parts In-Stock

1+ parts

$48.305

100+ parts

-

1k+ parts

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830

$48.305

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Corphita

USA . 4,350 parts In-Stock

1+ parts

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4,350

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Parana Technologies

USA . 1,332 parts In-Stock

1+ parts

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100+ parts

$30.714

1k+ parts

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10k+ parts

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1,332

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$30.714

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Overview

Enhance your electronic projects with the Z84C30BD2 from STMicroelectronics, a top-tier manufacturer known for delivering high-quality components. This versatile timer and real-time clock offers unmatched precision and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product provides exceptional value by ensuring accurate timing and seamless operation. Upgrade your designs with the Z84C30BD2 and experience the superior performance that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides high durability and reliability, making the product suitable for harsh environments.

Information Access Method: PARALLEL, DIRECT ADDRESS

The parallel access method allows for quick and efficient data retrieval, while the direct address method simplifies the process of accessing specific information.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources and prevents damage from overvoltage.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and easy to integrate into various electronic devices.

No. of Bits: 8

The 8-bit design allows for processing of large amounts of data, making the product suitable for applications that require precision timing and clock functions.

No. of Terminals: 28

The numerous terminals provide flexibility in connecting the product to external devices and systems for enhanced functionality.

Package Style (Meter): IN-LINE

The in-line package style simplifies the installation and maintenance of the product in a system, saving time and effort.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the product can operate efficiently even with limited power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the product to function reliably in various environmental conditions without overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the product remains functional in cold environments, making it versatile for different applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and electrical conductivity, ensuring secure connections for optimal performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connectivity, allowing for versatile integration in different electronic systems.

External Data Bus Width: 8

The 8-bit external data bus width enables efficient data transfer between the product and external devices, enhancing overall system performance.

Maximum Clock Frequency: 6 MHz

The high maximum clock frequency allows for precise timing and synchronization, making the product suitable for applications that require accurate timekeeping.

Peripheral IC Type: TIMER, PROGRAMMABLE

The programmable timer function provides customization options for specific timing requirements, making the product versatile for different applications.

No. of Timers: 4

Having four timers allows for multiple timing functions to be handled simultaneously, enhancing the product's utility in various time-sensitive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure mounting and reliable connections, ensuring stability and durability in operation.

Maximum Supply Current: 7 mA

The low maximum supply current consumption helps in reducing power usage and heat generation, contributing to energy efficiency and product longevity.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is commonly used in various electronic systems, ensuring compatibility and ease of integration with existing setups.

Bus Compatibility: Z80C

Compatibility with Z80C bus ensures seamless communication and data transfer within systems that utilize Z80C architecture, enhancing interoperability.

Technical Specifications

Timers & Real-Time Clocks Z84C30BD2 attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Additional Features:

DAISY CHAIN INTERRUPT STRUCTURE; PRESCALED /16, /256 TIMER I/P'S

Bus Compatibility:

Z80C

Maximum Clock Frequency:

6 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

JESD-30 Code:

R-CDIP-T28

JESD-609 Code:

e0

No. of Bits:

8

No. of Terminals:

28

No. of Timers:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

Z84C30BD2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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