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Z84C00BC6

STMicroelectronics

Z84C00BC6 by STMicroelectronics

Z84C00BC6 by STMicroelectronics is an 8-bit microprocessor with 16-bit address bus, operating at max 6 MHz. Ideal for industrial applications, it features low power mode and supports external interrupts. Package style: chip carrier, terminal finish: tin lead, and supply voltage range: 4.5-5.5 V make it versatile for various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,682 parts In-Stock

1+ parts

-

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1k+ parts

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4,682

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Anansix

USA . 1,452 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,452

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J2 Sourcing AB

Sweden . 298 parts In-Stock

1+ parts

-

100+ parts

-

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298

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-

-

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Digiode

USA . 181 parts In-Stock

1+ parts

-

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-

1k+ parts

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181

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

1+ parts

-

100+ parts

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,318 parts In-Stock

1+ parts

$19.084

100+ parts

-

1k+ parts

$17.176

10k+ parts

-

2,318

$19.084

-

$17.176

-

MKK Technologies

India . 532 parts In-Stock

1+ parts

$35.887

100+ parts

-

1k+ parts

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532

$35.887

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DigiPath Technology Company

USA . 532 parts In-Stock

1+ parts

$35.887

100+ parts

-

1k+ parts

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532

$35.887

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-

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Parana Technologies

USA . 1,572 parts In-Stock

1+ parts

-

100+ parts

$22.818

1k+ parts

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10k+ parts

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1,572

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$22.818

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Corphita

USA . 764 parts In-Stock

1+ parts

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764

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Overview

Unleash the power of innovation with the Z84C00BC6 by STMicroelectronics! As a leader in manufacturing top-quality microprocessors, STMicroelectronics delivers cutting-edge technology that is revolutionizing industries worldwide. This versatile chip carrier microprocessor boasts a wide range of applications, from industrial automation to consumer electronics, providing unparalleled performance and reliability. With a maximum clock frequency of 6 MHz and low power mode, this industrial-grade microprocessor ensures optimal efficiency while meeting the highest standards of quality. Experience the value and benefits of the Z84C00BC6 and take your projects to the next level with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microprocessor, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage tolerance allows for flexibility in power supply options, making it versatile for various applications.

Address Bus Width: 16

Wide address bus allows for efficient data transmission and processing, enhancing the performance of the microprocessor.

Package Shape: SQUARE

Square package shape optimizes space utilization on circuit boards, ideal for compact electronic devices.

Bit Size: 8

8-bit size ensures compatibility with a wide range of software and applications, making it a versatile choice for different projects.

Power Supplies (V): 5

Standard 5V power supply requirement makes it easy to integrate the microprocessor into existing electronic systems without the need for additional voltage regulators.

No. of Terminals: 44

A higher number of terminals provide more connectivity options for peripherals and external devices, increasing the capabilities of the microprocessor.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers excellent heat dissipation and protection for the microprocessor, ensuring stable performance under varying temperature conditions.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage ensures efficient power consumption and extends the operating range of the microprocessor, suitable for low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows the microprocessor to function reliably in harsh environments and industrial settings.

No. of External Interrupts: 2

Multiple external interrupts enable efficient multitasking and real-time processing, enhancing the responsiveness of the microprocessor in handling various inputs.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature rating ensures the microprocessor can function in cold environments or extreme temperature conditions, increasing its versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability, ensuring secure connections for stable performance.

Terminal Position: QUAD

Quad terminal position offers convenient and organized placement of connections, simplifying the installation process.

Maximum Seated Height: 4.57 mm

Low maximum seated height minimizes the profile of the microprocessor assembly, suitable for compact electronic devices or space-constrained applications.

Width: 16.5862 mm

Standard width dimension allows for easy integration into standard circuit board designs, offering compatibility with existing hardware layouts.

External Data Bus Width: 8

8-bit external data bus width enhances data transfer speeds and efficiency, improving the overall performance of the microprocessor in handling data.

Maximum Clock Frequency: 6 MHz

High maximum clock frequency enables fast processing speeds and real-time data handling, suitable for applications requiring rapid response times.

Length: 16.5862 mm

Standard length dimension ensures compatibility with common circuit board sizes and layouts, facilitating easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environments with temperature fluctuations and variations.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, it offers advanced processing capabilities, making it suitable for complex computing tasks and applications that require high performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient operation and reliable performance in various electronic devices.

Terminal Form: J BEND

J bend terminal form offers secure and reliable connections, minimizing the risk of disconnections or signal loss in the microprocessor assembly.

Maximum Supply Current: 22 mA

Low maximum supply current requirement reduces power consumption and heat generation, contributing to energy-efficient operation and extended battery life.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage ensures consistent and reliable performance of the microprocessor, supporting uninterrupted operation of electronic systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch provides compatibility with common socket designs and connectors, facilitating easy integration of the microprocessor into electronic assemblies.

Format: FIXED POINT

Fixed-point format simplifies numerical calculations and data processing, offering precise and efficient computation capabilities for various applications.

Speed: 6 rpm

6 rpm speed capability enables fast data processing and computation tasks, suitable for applications requiring rapid and efficient operation.

Low Power Mode: YES

Low power mode feature helps reduce power consumption during idle or low-load operations, improving energy efficiency and extending battery life in portable devices.

Technical Specifications

Microprocessors Z84C00BC6 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Additional Features:

DRAM REFRESH CONTROLLER

Address Bus Width:

16

Bit Size:

8

Boundary Scan:

NO

Maximum Clock Frequency:

6 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.5862 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

2

No. of Serial I/Os:

0

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Speed:

6 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

22 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

Z84C00BC6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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