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X0402NE1AA2

STMicroelectronics

X0402NE1AA2 by STMicroelectronics

X0402NE1AA2 by STMicroelectronics is a sensitive gate thyristor ideal for high-voltage applications, featuring an off-state voltage of 800V and a max on-state current of 900mA. It operates efficiently in temperatures from -40 °C to 125 °C. Packaged in TO-202, it's suitable for through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,455 parts In-Stock

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6,455

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Digiode

USA . 2,392 parts In-Stock

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Anansix

USA . 130 parts In-Stock

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130

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Distributors (Availability)

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AZTECH Wire

Italy . 1,070 parts In-Stock

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$10.950

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1,070

$10.950

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Component Stockers USA

USA . 777 parts In-Stock

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$99.990

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777

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 2,050 parts In-Stock

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2,050

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IDEA Electronic Components Group

UK . 805 parts In-Stock

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805

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Corphita

USA . 416 parts In-Stock

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MKK Technologies

India . 361 parts In-Stock

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DigiPath Technology Company

USA . 361 parts In-Stock

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361

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Parana Technologies

USA . 38 parts In-Stock

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Overview

Unlock the power of reliability with the X0402NE1AA2 from STMicroelectronics, a leader in semiconductor innovation. This high-performance thyristor is designed for diverse applications, from motor control to power switching, ensuring seamless operation even under extreme conditions. With its impressive voltage capability and compact packaging, it offers exceptional value, enhancing efficiency while minimizing space. Trust STMicroelectronics to deliver unmatched quality and elevate your designs today!

Feature Benefit Bullets

Other Names: 497-4506

The alternative name ensures compatibility and ease of identification across various platforms.

Standard Package: 250

Sold in bulk, facilitating efficient inventory management for large-scale applications.

Category: Discrete Semiconductor Products, Thyristors, SCRs

Part of a reliable category for controlling electrical power, suitable for a wide range of applications.

Packaging: Bulk

Bulk packaging minimizes waste and lowers shipping costs, making it cost-effective for businesses.

Voltage - Off State: 800 V

High off-state voltage ensures robust performance in demanding electrical environments.

Voltage - Gate Trigger (Vgt) (Max): 800 mV

Low gate trigger voltage allows for easy interfacing with low-voltage control circuits.

Current - Gate Trigger (Igt) (Max): 200 µA

Low gate trigger current helps in reducing power consumption while maintaining effective operation.

Voltage - On State (Vtm) (Max): 1.8 V

Minimal on-state voltage drop enhances efficiency and minimizes energy loss during operation.

Current - On State (It (AV)) (Max): 900 mA

High average on-state current capacity makes it suitable for a variety of applications requiring significant power.

Current - On State (It (RMS)) (Max): 1.35 A

Capable of handling high RMS current, enabling reliable performance in demanding scenarios.

Current - Hold (Ih) (Max): 5 mA

Low holding current contributes to energy conservation and increases the overall efficiency of the circuit.

Current - Off State (Max): 5 µA

Minimal off-state current ensures that the circuit maintains low leakage, preserving efficiency in standby mode.

Current - Non Rep. Surge 50, 60Hz (Itsm): 30A, 33A

Offers high surge current ratings, ensuring durability against transient spikes in power systems.

SCR Type: Sensitive Gate

Sensitive gate design allows for easier triggering with lower input power, enhancing application versatility.

Operating Temperature: -40 °C ~ 125 °C

Wide operating temperature range makes this component suitable for diverse environmental conditions.

Mounting Type: Through Hole

Through-hole mounting provides robust mechanical stability for demanding applications.

Package / Case: TO-202 Long Tab

Standardized packaging facilitates integration into existing designs and improves thermal performance.

Supplier Device Package: TO-202

Utilizes a common packaging type, ensuring easy replacement and sourcing from multiple suppliers.

Base Product Number: X0402

Identifiable base product number helps in tracking specifications and compatibility with other components.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Unlimited moisture sensitivity indicates robust packaging that can handle open shelf life without degradation.

Technical Specifications

Additional Parts X0402NE1AA2 attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

497-4506

Current - Off State (Max):

5 µA

Operating Temperature:

-40°C ~ 125°C

Category:

Discrete Semiconductor Products
Thyristors SCRs

Current - Hold (Ih) (Max):

5 mA

SCR Type:

Sensitive Gate

Voltage - Gate Trigger (Vgt) (Max):

800 mV

Current - Gate Trigger (Igt) (Max):

200 µA

Voltage - On State (Vtm) (Max):

1.8 V

Current - On State (It (AV)) (Max):

900 mA

Mounting Type:

Through Hole

Supplier Device Package:

TO-202

Standard Package:

250

Voltage - Off State:

800 V

Package / Case:

TO-202 Long Tab

Packaging:

Bulk

Current - On State (It (RMS)) (Max):

1.35 A

Current - Non Rep. Surge 50, 60Hz (Itsm):

30A, 33A

Base Product Number:

X0402

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

X0402NE1AA2 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8541.30.0080

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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