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VB125ASP613TR

STMicroelectronics

VB125ASP613TR by STMicroelectronics

VB125ASP613TR by STMicroelectronics is a robust power distribution switch with a 1:1 input-output ratio, supporting loads from 6V to 24V and max output current of 11.1A. It features over-temperature protection and operates in extreme temps (-40 °C to 150°C). Ideal for surface mount applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,167 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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13,167

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Digiode

USA . 4,760 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,760

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Anansix

USA . 2,674 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,674

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ComSIT Distribution GmbH

Germany . 2,395 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$15.570

100+ parts

-

1k+ parts

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10k+ parts

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190

$15.570

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Microchip USA

USA . 5,068 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,068

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Vigor

Singapore . 2,871 parts In-Stock

1+ parts

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2,871

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Corphita

USA . 2,288 parts In-Stock

1+ parts

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2,288

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MKK Technologies

India . 2,189 parts In-Stock

1+ parts

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2,189

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DigiPath Technology Company

USA . 2,189 parts In-Stock

1+ parts

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2,189

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Parana Technologies

USA . 1,484 parts In-Stock

1+ parts

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100+ parts

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1,484

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

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100+ parts

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1,373

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Overview

Elevate your designs with the VB125ASP613TR from STMicroelectronics, a trusted leader in innovative power management solutions. This premium power distribution switch excels in efficiency and reliability, handling loads of 6V to 24V with ease. Designed for robust applications, it features enhanced safety with fault protection and operates seamlessly in extreme conditions. Experience superior performance that empowers your projects and drives success—choose STMicroelectronics for quality you can rely on!

Feature Benefit Bullets

Standard Package: 600

With a standard package of 600, this product supports bulk purchasing, making it suitable for high-volume applications.

Category: Integrated Circuits (ICs) - Power Management (PMIC) - Power Distribution Switches, Load Drivers

This product falls under the essential category of power management, ensuring reliable function in demanding electronic systems.

Series: VIPower™

Utilizing the VIPower™ series ensures high efficiency and enhanced performance in power distribution applications.

Packaging: Tape & Reel (TR)

The tape and reel packaging allows for automated assembly processes, reducing labor costs and improving production efficiency.

Ratio - Input:Output: 1:1

The 1:1 input-output ratio simplifies designs, ensuring consistent power delivery without conversion losses.

Output Configuration: Low Side

Low side output configuration is advantageous for easy integration in various electronic applications, enhancing design flexibility.

Output Type: Bipolar

The bipolar output type allows for better control of current and voltage levels, benefiting a range of operating conditions.

Interface: Parallel

The parallel interface enables multiple devices to work together effectively, which is ideal for robust applications.

Voltage - Load: 6V ~ 24V

A wide voltage load range supports a variety of applications, making it versatile across different projects.

Current - Output (Max): 11.1A

With a maximum output current of 11.1A, this product provides ample power delivery for demanding loads.

Input Type: Non-Inverting

Being non-inverting simplifies circuit design, promoting ease of integration in multiple configurations.

Features: Status Flag

Incorporating a status flag feature allows for effective monitoring and troubleshooting of the component's performance.

Fault Protection: Over Temperature

Integrated over-temperature fault protection ensures reliability and safety in prolonged operation, preventing damage.

Operating Temperature: -40 °C ~ 150°C (TJ)

A wide operating temperature range guarantees performance in extreme conditions, ideal for industrial applications.

Mounting Type: Surface Mount

Surface mount technology promotes compact design and efficient use of PCB space, beneficial in modern electronics.

Supplier Device Package: 10-PowerSO

The 10-PowerSO package offers a balance between size and thermal efficiency, suitable for high power applications.

Package / Case: PowerSO-10 Exposed Bottom Pad

The exposed bottom pad enhances thermal conductivity, improving heat dissipation for reliable operation.

Base Product Number: VB125

The base product number simplifies ordering and inventory management, ensuring ease of access for procurement.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

A moisture sensitivity level of 1 indicates safe handling and storage practices, reducing risks of damage during assembly.

Technical Specifications

Additional Parts VB125ASP613TR attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Operating Temperature:

-40°C ~ 150°C (TJ)

Input Type:

Non-Inverting

Category:

Integrated Circuits (ICs)
Power Management (PMIC) Power Distribution Switches, Load Drivers

Output Type:

Bipolar

Switch Type:

General Purpose

Output Configuration:

Low Side

Ratio - Input:Output:

1:1

Voltage - Load:

6V ~ 24V

Mounting Type:

Surface Mount

Current - Output (Max):

11.1A

Supplier Device Package:

10-PowerSO

Standard Package:

600

Number of Outputs:

1

Series:

VIPower™

Fault Protection:

Over Temperature

Package / Case:

PowerSO-10 Exposed Bottom Pad

Packaging:

Tape & Reel (TR)

Features:

Status Flag

Voltage - Supply (Vcc/Vdd):

Not Required

Interface:

Parallel

Base Product Number:

VB125

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

VB125ASP613TR Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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