Loading...

USB6B2

STMicroelectronics

USB6B2 by STMicroelectronics

USB6B2 by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for robust protection in electronic circuits. It features a max reverse power dissipation of 500 W, operates b/w -55 °C to 150°C, and has a breakdown voltage of 6 V. Ideal for safeguarding sensitive components from voltage spikes, it ensures reliability in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,147

-

-

-

-

Digiode

USA . 1,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,469

-

-

-

-

Anansix

USA . 587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

587

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 821 parts In-Stock

1+ parts

$0.059

100+ parts

-

1k+ parts

$0.053

10k+ parts

-

821

$0.059

-

$0.053

-

MKK Technologies

India . 131 parts In-Stock

1+ parts

$0.111

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$0.111

-

-

-

DigiPath Technology Company

USA . 131 parts In-Stock

1+ parts

$0.111

100+ parts

-

1k+ parts

-

10k+ parts

-

131

$0.111

-

-

-

Parana Technologies

USA . 1,593 parts In-Stock

1+ parts

-

100+ parts

$0.070

1k+ parts

-

10k+ parts

-

1,593

-

$0.070

-

-

Corphita

USA . 1,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

-

-

-

-

Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Overview

Protect your electronic designs with the USB6B2 from STMicroelectronics, a leading name in innovation. This reliable transient suppression device safeguards sensitive components from voltage spikes, ensuring robust performance in diverse applications—from consumer electronics to industrial systems. Built for resilience and efficiency, it operates across extreme temperatures, offering peace of mind and longevity, making it an invaluable addition to your product line.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good insulation and thermal stability, which enhances the reliability of the device.

Config: SINGLE

A single configuration simplifies the design and integration, making it easier to implement in various applications.

Maximum Non Repetitive Peak Reverse Power Dissipation: 500 W

With a high power dissipation capability, this device can effectively handle transient voltage spikes without damage.

Maximum Reverse Current: 5 uA

Low reverse current minimizes leakage and power loss, making this device energy-efficient during operation.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for more compact designs.

Reverse Test Voltage: 5.25 V

A test voltage of 5.25 V helps verify reliability, ensuring that the device can withstand standard electrical conditions.

No. of Terminals: 8

With 8 terminals, the device allows for diverse connectivity options, facilitating various circuit configurations.

Package Style (Meter): IN-LINE

An in-line package style makes it easy to install in routing and helps in maintaining a low-profile design.

Maximum Operating Temperature: 150 °C

The device’s high maximum operating temperature ensures it can function optimally in demanding conditions.

Minimum Operating Temperature: -55 °C

A wide temperature range means this device can be used in extreme environments, making it versatile for various applications.

Terminal Position: DUAL

A dual terminal position allows for easier placement and connectivity in circuit designs, improving usability.

Minimum Breakdown Voltage: 6 V

A minimum breakdown voltage of 6 V ensures adequate protection against voltage surges in the circuit.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

This specific type of diode is designed for transient suppression, making it ideal for protecting sensitive components.

Technology: AVALANCHE

Avalanche technology allows for rapid response to voltage spikes, effectively clamping transients in critical situations.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical and electrical connections, enhancing device reliability in various applications.

Maximum Repetitive Peak Reverse Voltage: 6 V

With a maximum repetitive peak reverse voltage of 6 V, this product is well-suited for applications requiring consistent voltage suppression.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures effective protection in specific circuit designs where reverse voltage conditions are not expected.

Diode Element Material: SILICON

Silicon construction provides excellent electrical characteristics and durability, ensuring long-term performance of the device.

Technical Specifications

Transient Suppression Devices USB6B2 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Additional Features:

VERY LOW CAPACITANCE

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDIP-T8

Maximum Non Repetitive Peak Reverse Power Dissipation:

500 W

No. of Elements:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

IN-LINE

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

6 V

Maximum Reverse Current:

5 uA

Reverse Test Voltage:

5.25 V

Sub-Category:

Other Diodes

Surface Mount:

NO

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

USB6B2 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3