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TSX5070FN013TR

STMicroelectronics

TSX5070FN013TR by STMicroelectronics

TSX5070FN013TR by STMicroelectronics is a PCM filter IC featuring 1 ADC and 1 DAC, ideal for audio applications. Packaged in a 28-LCC format, it supports surface mounting and comes in tape & reel for efficient handling. With MSL level 1, it's suitable for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,039 parts In-Stock

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2,039

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Vyrian

USA . 2,038 parts In-Stock

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2,038

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Anansix

USA . 1,343 parts In-Stock

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1,343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 186 parts In-Stock

1+ parts

$1.000

100+ parts

-

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186

$1.000

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AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$16.100

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877

$16.100

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Parana Technologies

USA . 2,371 parts In-Stock

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2,371

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IDEA Electronic Components Group

UK . 1,192 parts In-Stock

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1,192

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MKK Technologies

India . 225 parts In-Stock

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225

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DigiPath Technology Company

USA . 225 parts In-Stock

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225

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Corphita

USA . 158 parts In-Stock

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158

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Overview

Unlock unparalleled audio performance with the TSX5070FN013TR from STMicroelectronics, a trusted leader in cutting-edge technology. This high-quality integrated circuit enhances your PCM audio experience, making it ideal for applications ranging from consumer electronics to professional audio systems. Packaged conveniently in tape and reel, it ensures ease of use in production. Enjoy superior reliability and support, backed by STMicroelectronics' commitment to innovation and excellence.

Feature Benefit Bullets

Other Names: 497-2336-1, 497-2336-2

Having multiple identifiers ensures compatibility and ease of sourcing, making it versatile for various applications.

Standard Package: 500

A standard package quantity of 500 makes it suitable for both small-scale prototypes and larger production runs.

Category: Integrated Circuits (ICs), Interface CODECS

Categorized under integrated circuits and interface CODECs, this product is tailored for high-quality audio processing.

Packaging: Tape & Reel (TR)

The tape and reel packaging allows for automated assembly processes, enhancing manufacturing efficiency.

Type: PCM, Filter

Utilizing PCM and filtering technology provides clear audio signals, making this product excellent for audio applications.

Data Interface: PCM Audio Interface

The PCM audio interface ensures high fidelity and reliable data communication for audio applications.

Number of ADCs / DACs: 1 / 1

Having one ADC and one DAC simplifies integration while offering essential audio conversion capabilities.

Mounting Type: Surface Mount

Surface mount technology reduces space requirements on PCBs, allowing for compact designs.

Package / Case: 28-LCC (J-Lead)

The 28-LCC (J-Lead) package design provides robust electrical connection points for stability during installation.

Supplier Device Package: 28-PLCC (11.5x11.5)

The specific dimension of 11.5x11.5 mm ensures it can fit into standardized spaces on PCBs.

Base Product Number: TSX5070

The TSX5070 base part number indicates a reliable and well-documented product that users can trust.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

An MSL rating of 1 means this product is not sensitive to moisture, ensuring reliability in various environments.

Technical Specifications

Additional Parts TSX5070FN013TR attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

497-2336-1
497-2336-2

Category:

Integrated Circuits (ICs)
Interface CODECS

Data Interface:

PCM Audio Interface

Number of ADCs / DACs:

1 / 1

Mounting Type:

Surface Mount

Sigma Delta:

No

Supplier Device Package:

28-PLCC (11.5x11.5)

Standard Package:

500

Type:

PCM, Filter

Package / Case:

28-LCC (J-Lead)

Packaging:

Tape & Reel (TR)

Base Product Number:

TSX5070

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TSX5070FN013TR Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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