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TSV912IYD

STMicroelectronics

TSV912IYD by STMicroelectronics

TSV912IYD by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 7500 µV and low bias current of 10 pA. It operates at supply voltages of 3/5 V, making it ideal for automotive applications. With a nominal CMRR of 78 dB, it ensures high precision in signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,752 parts In-Stock

1+ parts

-

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7,752

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Digiode

USA . 3,635 parts In-Stock

1+ parts

-

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3,635

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Anansix

USA . 2,338 parts In-Stock

1+ parts

-

100+ parts

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2,338

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,593 parts In-Stock

1+ parts

$5.696

100+ parts

-

1k+ parts

$5.126

10k+ parts

-

1,593

$5.696

-

$5.126

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$7.290

100+ parts

$6.634

1k+ parts

$5.978

10k+ parts

-

500

$7.290

$6.634

$5.978

-

MKK Technologies

India . 1,762 parts In-Stock

1+ parts

$10.710

100+ parts

-

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1,762

$10.710

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DigiPath Technology Company

USA . 1,762 parts In-Stock

1+ parts

$10.710

100+ parts

-

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-

10k+ parts

-

1,762

$10.710

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-

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Microchip USA

USA . 348 parts In-Stock

1+ parts

$18.340

100+ parts

-

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348

$18.340

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AZTECH Wire

Italy . 1,091 parts In-Stock

1+ parts

$20.880

100+ parts

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1,091

$20.880

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Component Stockers USA

USA . 451 parts In-Stock

1+ parts

$99.990

100+ parts

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451

$99.990

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Vigor

Singapore . 10,000 parts In-Stock

1+ parts

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10,000

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Corphita

USA . 3,959 parts In-Stock

1+ parts

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3,959

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Perfect Parts

USA . 2,185 parts In-Stock

1+ parts

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2,185

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Parana Technologies

USA . 619 parts In-Stock

1+ parts

-

100+ parts

$6.810

1k+ parts

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619

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$6.810

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Overview

Elevate your designs with the TSV912IYD operational amplifier from STMicroelectronics, a trusted leader in high-performance solutions. This dual op-amp delivers exceptional precision and low power consumption, making it perfect for automotive applications and beyond. Its compact design ensures seamless integration, while its robust temperature tolerance guarantees reliability under extreme conditions. Experience unmatched quality and innovation that empowers your projects to excel!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and protection against environmental factors.

Maximum Input Offset Voltage: 7500 uV

A low offset voltage allows for improved accuracy in applications requiring precision signal amplification.

Maximum Average Bias Current (IIB): 0.00001 uA

Ultra-low bias current ensures minimal error and power consumption, making it ideal for battery-operated devices.

Surface Mount: YES

Surface mount compatibility makes it suitable for modern PCB designs, enabling efficient use of space.

No. of Functions: 2

Multi-functional capability offers flexibility in circuit design, reducing component count and saving costs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and space management on the PCB.

Nominal Common Mode Reject Ratio: 78 dB

High CMRR enhances performance by minimizing the effect of noise and interference on the input signals.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for low power applications, ensuring energy efficiency in designs.

Power Supplies (V): 3/5

Dual supply options provide flexibility for a wide range of applications across different voltage levels.

No. of Terminals: 8

Eight terminals facilitate easy integration into circuits and enable versatile connections.

Package Style (Meter): SMALL OUTLINE

The small outline design is ideal for compact devices, allowing for a smaller overall product footprint.

Maximum Supply Voltage Limit: 6 V

The supply voltage limit ensures compatibility with various devices while maintaining safety margins.

Maximum Operating Temperature: 125 °C

High temperature tolerance supports applications in harsh environments, ensuring reliability and longevity.

Maximum Bias Current (IIB) @ 25 °C: 0.00001 uA

Consistent low bias current characteristics make it suitable for sensitive analog applications, enhancing performance.

Frequency Compensation: YES

Built-in frequency compensation allows for stable operation across a range of frequencies, improving usability.

Minimum Voltage Gain: 10000

High voltage gain makes it suitable for amplifying small signals effectively, beneficial for various applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in both extreme cold and hot environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish promotes superior conductivity and resistance to corrosion, enhancing durability.

Terminal Position: DUAL

Dual terminal positioning allows for convenient connections in various circuit layouts.

Maximum Seated Height: 1.75 mm

Low height enables design flexibility in slim devices without compromising performance.

Width: 3.9 mm

Narrow width facilitates compact PCB design, allowing for more efficient utilization of space.

Maximum Time At Peak Reflow Temperature (s): 40

Extended peak reflow time allows for robust soldering processes, ensuring reliable component attachment.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance means the device can withstand modern soldering techniques.

Length: 4.9 mm

Short length is ideal for densely packed designs, optimizing space on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive grade components guarantee reliability and performance in demanding applications, ideal for vehicles.

Low-Bias: YES

Low-bias characteristics make this op-amp an excellent choice for low-power applications, reducing overall energy costs.

Nominal Unity Gain Bandwidth: 8000 kHz

High bandwidth ensures support for a wide range of signal frequencies, crucial for high-speed applications.

Technology: BICMOS

BICMOS technology combines the best features of bipolar and CMOS, offering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide reliable mounting, facilitating easy assembly and soldering.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile for various applications such as filtering, amplifying, and signal conditioning.

Maximum Supply Current: 2.2 mA

Low supply current allows for minimal power draw, beneficial for portable and battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture simplifies circuit design and enhances stability, making it easy to implement.

Packing Method: TUBE

Tube packing protects components during transport and ensures easy handling during assembly.

Nominal Slow Rate: 4.5 V/us

Adequate slow rate enhances response times in various applications, ensuring effective signal processing.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates compatibility with a wide range of PCB designs, ensuring easy integration.

Technical Specifications

Operational Amplifiers (Op Amps) TSV912IYD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

78 dB

Input Offset Voltage Limit:

7500 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

4.5 V/us

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

2.2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV912IYD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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