Loading...

TSV6390ICT

STMicroelectronics

TSV6390ICT by STMicroelectronics

TSV6390ICT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 4500 µV, a nominal voltage of 1.8 V, and operates within -40 °C to 125°C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,139

-

-

-

-

Anansix

USA . 2,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,511

-

-

-

-

Digiode

USA . 1,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,709

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,695 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,695

$0.470

-

-

-

Microchip USA

USA . 5,724 parts In-Stock

1+ parts

$3.565

100+ parts

-

1k+ parts

-

10k+ parts

-

5,724

$3.565

-

-

-

IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$3.859

100+ parts

-

1k+ parts

$3.473

10k+ parts

-

1,352

$3.859

-

$3.473

-

MKK Technologies

India . 500 parts In-Stock

1+ parts

$7.257

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$7.257

-

-

-

DigiPath Technology Company

USA . 500 parts In-Stock

1+ parts

$7.257

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$7.257

-

-

-

Ampacity Inc.

Singapore . 1,178 parts In-Stock

1+ parts

$7.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,178

$7.410

-

-

-

Component Stockers USA

USA . 13,575 parts In-Stock

1+ parts

$9.740

100+ parts

-

1k+ parts

-

10k+ parts

-

13,575

$9.740

-

-

-

AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$19.510

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$19.510

-

-

-

Kepictronics

USA . 47,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

47,505

-

-

-

-

Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,720

-

-

-

-

RC Electronics

USA . 5,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,400

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,262

-

-

-

-

Corphita

USA . 2,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,049

-

-

-

-

Parana Technologies

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

$4.614

1k+ parts

-

10k+ parts

-

1,986

-

$4.614

-

-

Overview

Elevate your designs with the TSV6390ICT from STMicroelectronics—a benchmark in operational amplifiers. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this ultra-low power op-amp that excels in precision applications, making it perfect for automotive and portable devices. Experience superior performance with enhanced reliability, ensuring your projects are efficient and cutting-edge. Unlock endless possibilities while enjoying exceptional technical support and a robust supply chain!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material contributes to durability and reliability, making the operational amplifier suitable for various applications.

Maximum Input Offset Voltage: 4500 uV

A maximum input offset voltage of 4500 uV allows for better precision in applications where accuracy is critical.

Maximum Average Bias Current (IIB): 0.0001 uA

With an extremely low average bias current, this op amp is highly efficient, making it an ideal choice for low-power applications.

Surface Mount: YES

The surface mount feature allows for easy integration into compact electronic designs, saving space on PCB layouts.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient placement and routing on PCB, optimizing design flexibility.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode reject ratio minimizes interference, ensuring that the op amp performs reliably in noisy environments.

Nominal Supply Voltage / Vsup (V): 1.8

With a low nominal supply voltage of 1.8V, this op amp is compatible with modern low-voltage systems, enhancing power savings.

Power Supplies (V): 1.8/5

Support for multiple supply voltages caters to a wide range of applications, ensuring versatility in usage.

No. of Terminals: 6

The 6-terminal configuration provides flexibility in designing circuits while maintaining compactness.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for a thin profile and efficient layout, making it suitable for space-constrained designs.

Maximum Supply Voltage Limit: 6 V

The operating limit of 6V ensures that the op amp can function effectively in higher voltage environments without risk of damage.

Maximum Operating Temperature: 125 °C

The extended operational temperature range ensures reliable performance in high heat environments, making it suitable for automotive applications.

Frequency Compensation: YES

Built-in frequency compensation provides stability across a range of operating conditions, improving performance in dynamic applications.

Minimum Voltage Gain: 10000

A minimum voltage gain of 10000 allows for effective amplification, making it suitable for applications requiring high gain.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures ensures reliability in challenging environmental conditions, particularly in automotive settings.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and ensures long-term reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing and placement on circuit boards, enhancing design flexibility.

Maximum Seated Height: 1.1 mm

A low seated height allows for low-profile designs, making it ideal for compact electronic products.

Width: 1.25 mm

The compact width further aids in space-saving designs while ensuring easy integration into existing layouts.

Micropower: YES

Micropower capabilities make it an exceptional choice for battery-operated devices, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

Support for a maximum peak reflow time of 30 seconds makes it compatible with modern assembly techniques.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance allows for robust soldering processes, essential for reliable manufacturing.

Length: 2 mm

A minimal length aids in compact board designs, making it suitable for miniaturized devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade classification ensures durability and dependability under rigorous conditions, perfect for automotive applications.

Low-Bias: YES

Low-bias characteristics enhance performance in precision applications, ensuring minimized errors in signal processing.

Nominal Unity Gain Bandwidth: 2000 kHz

High unity gain bandwidth ensures fast signal processing capabilities, suitable for high-frequency applications.

Technology: CMOS

CMOS technology allows for low power consumption and high performance, making this product ideal for energy-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form is advantageous for PCB assembly and provides robust mechanical and electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this component is versatile for various applications including signal conditioning and filtering.

Maximum Supply Current: 0.072 mA

The extremely low supply current further enhances the efficiency, making it ideal for battery-powered circuits.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture allows for stable performance and easier circuit design in various applications.

Packing Method: TAPE AND REEL

Tape and reel packing ensures efficient handling and assembly, suitable for high-volume manufacturing.

Nominal Slow Rate: 0.7 V/µs

A moderate slew rate of 0.7 V/µs provides stability in response time, which is beneficial for many practical applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm facilitates easier placement and soldering, especially in high-density boards.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6390ICT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.7 V/us

Peak Bias Current:

100 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

72 μA

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TSV6390ICT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20