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TSV632AID

STMicroelectronics

TSV632AID by STMicroelectronics

TSV632AID from STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 2000 µV, low bias current of 0.0001 µA, and operates within a supply range of 1.8-5 V. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,415 parts In-Stock

1+ parts

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5,415

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Digiode

USA . 4,835 parts In-Stock

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4,835

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Anansix

USA . 1,755 parts In-Stock

1+ parts

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1,755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$5.613

100+ parts

-

1k+ parts

$5.052

10k+ parts

-

273

$5.613

-

$5.052

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AZTECH Wire

Italy . 1,182 parts In-Stock

1+ parts

$9.970

100+ parts

-

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1,182

$9.970

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MKK Technologies

India . 1,574 parts In-Stock

1+ parts

$10.555

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1,574

$10.555

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DigiPath Technology Company

USA . 1,574 parts In-Stock

1+ parts

$10.555

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1,574

$10.555

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Microchip USA

USA . 381 parts In-Stock

1+ parts

$17.217

100+ parts

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381

$17.217

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Component Stockers USA

USA . 421 parts In-Stock

1+ parts

$99.990

100+ parts

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421

$99.990

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Corphita

USA . 2,311 parts In-Stock

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2,311

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Parana Technologies

USA . 1,892 parts In-Stock

1+ parts

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100+ parts

$6.711

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1,892

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$6.711

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Vigor

Singapore . 1,500 parts In-Stock

1+ parts

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1,500

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Overview

Elevate your designs with the TSV632AID from STMicroelectronics, a pinnacle of operational amplifier innovation. Known for exceptional quality and reliability, this micropower op-amp offers outstanding performance in automotive applications, ensuring precision even in extreme conditions. With a compact package and low-bias characteristics, it empowers engineers to create efficient and robust solutions. Trust STMicroelectronics to deliver unmatched value, enhancing your projects with superior functionality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stress, making this product reliable for various applications.

Maximum Input Offset Voltage: 2000 µV

A low input offset voltage is crucial for precision applications, enhancing measurement accuracy and performance.

Maximum Average Bias Current (IIB): 0.0001 µA

The ultra-low average bias current allows efficient power consumption, making it suitable for battery-powered devices.

Surface Mount: YES

Surface mount technology provides compact designs and easier integration into modern electronic circuits.

No. of Functions: 2

Two functions within the same package offer design flexibility, allowing for more versatile circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for layout efficiency on circuit boards, facilitating space-saving designs.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode reject ratio enhances the amplifier's ability to filter out noise, improving signal integrity.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage allows compatibility with low-power systems and extends battery life.

Power Supplies (V): 1.8/5

Dual supply voltage options provide versatility for various application requirements, increasing design adaptability.

No. of Terminals: 8

Eight terminals allow for comprehensive circuit connections, supporting complex designs in compact packages.

Package Style (Meter): SMALL OUTLINE

The small outline packages promote space efficiency in PCB design, ideal for handheld or compact devices.

Minimum Slew Rate: 0.2 V/µs

A minimum slew rate enables the handling of rapid signal changes, crucial for high-frequency applications.

Maximum Supply Voltage Limit: 6 V

A higher supply voltage limit expands application possibilities, accommodating diverse circuit conditions.

Maximum Operating Temperature: 125 °C

High-temperature tolerance allows for operation in demanding environments, ensuring reliability in automotive and industrial applications.

Maximum Bias Current (IIB) @ 25 °C: 0.00001 µA

An extremely low bias current at room temperature further enhances efficiency, making it ideal for precision low-power devices.

Frequency Compensation: YES

Integrated frequency compensation stabilizes the operational amplifier's performance across various frequencies, ensuring reliable operation.

Minimum Voltage Gain: 10000

A high minimum voltage gain enhances the amplifier's capability to amplify weak signals, making it suitable for sensor applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in extreme environments, making it ideal for automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in board layouts, enabling more efficient utilization of space in design.

Maximum Seated Height: 1.75 mm

A low seated height supports low-profile designs, contributing to miniaturization in electronic devices.

Width: 3.9 mm

Compact width allows for flexible placement and ease of integration into tight spaces on circuit boards.

Micropower: YES

Micropower consumption translates to extended battery life in portable applications, enhancing user experience.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand peak reflow conditions ensures reliability during assembly processes, reducing the risk of damage.

Peak Reflow Temperature (°C): 260

High reflow temperature tolerance allows compatibility with various soldering processes, making it adaptable in manufacturing.

Length: 4.9 mm

A compact length further supports space-efficient designs, essential for modern electronic applications.

Temperature Grade: AUTOMOTIVE

Automotive grading ensures the component is suitable for vehicle applications, meeting stringent automotive standards.

Low-Bias: YES

Low-bias characteristics enhance the accuracy of amplification in sensitive applications, such as medical devices.

Nominal Unity Gain Bandwidth: 790 kHz

A high unity gain bandwidth enables effective performance in wide frequency applications, allowing for versatile uses.

Technology: CMOS

The CMOS technology results in low power consumption and high integration capabilities, perfect for portable and compact applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and soldering processes, enhancing manufacturability.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it supports a wide range of functions such as amplification, filtering, and signal conditioning.

Maximum Supply Current: 0.124 mA

Low supply current helps maintain energy efficiency in devices, making it ideal for low-power applications.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture provides versatility and consistency in performance across a variety of applications.

Packing Method: TUBE

Tube packing provides protection during shipping and ease of access for assembly processes, promoting efficiency.

Nominal Slow Rate: 0.27 V/µs

Nominal slow rate enables stable operation under dynamic conditions, essential for consistent signal processing.

Terminal Pitch: 1.27 mm

Standard pitch allows compatibility with common PCB layouts, simplifying integration into designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSV632AID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

790 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.2 V/us

Nominal Slew Rate:

0.27 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

124 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV632AID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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