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TSV6292IDT

STMicroelectronics

TSV6292IDT by STMicroelectronics

TSV6292IDT from STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 6 mV, low bias current of 0.1 nA, and operates within a supply range of 1.8-5 V. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,802 parts In-Stock

1+ parts

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4,802

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R&J Components

USA . 2,498 parts In-Stock

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2,498

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Digiode

USA . 2,402 parts In-Stock

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2,402

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Anansix

USA . 2,005 parts In-Stock

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2,005

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,286 parts In-Stock

1+ parts

$0.570

100+ parts

-

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2,286

$0.570

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Microchip USA

USA . 4,202 parts In-Stock

1+ parts

$4.201

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4,202

$4.201

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IDEA Electronic Components Group

UK . 2,207 parts In-Stock

1+ parts

$6.755

100+ parts

-

1k+ parts

$6.079

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-

2,207

$6.755

-

$6.079

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Component Stockers USA

USA . 8,027 parts In-Stock

1+ parts

$11.170

100+ parts

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8,027

$11.170

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MKK Technologies

India . 2,016 parts In-Stock

1+ parts

$12.702

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2,016

$12.702

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DigiPath Technology Company

USA . 2,016 parts In-Stock

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$12.702

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2,016

$12.702

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AZTECH Wire

Italy . 1,089 parts In-Stock

1+ parts

$13.130

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1,089

$13.130

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A-Z Elektronik GmbH

Germany . 6,578 parts In-Stock

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6,578

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Perfect Parts

USA . 5,460 parts In-Stock

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Corphita

USA . 1,185 parts In-Stock

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1,185

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Parana Technologies

USA . 44 parts In-Stock

1+ parts

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$8.076

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44

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$8.076

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Overview

Elevate your designs with the TSV6292IDT from STMicroelectronics—a top-tier operational amplifier crafted for precision and reliability. With exceptional performance in automotive applications, this micropower op-amp delivers unmatched low bias currents and high common mode rejection, ensuring optimal signal integrity. Trust in STMicroelectronics' legacy of innovation for solutions that enhance efficiency and elevate your projects to new heights. Experience quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability while keeping the component lightweight, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 6000 uV

A maximum input offset voltage of 6000 µV indicates a higher tolerance for signal inaccuracies, which can be critical for precision applications.

Maximum Average Bias Current (IIB): 0.0001 uA

Extremely low average bias current ensures minimal impact on circuit behavior, making this op amp ideal for battery-powered applications.

Surface Mount: YES

Being surface mount compatible allows for higher density PCB layouts, saving space in compact electronic designs.

No. of Functions: 2

Offering two functions makes it versatile for different circuit requirements without the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of integration into various PCB designs and aids in thermal management.

Nominal Common Mode Reject Ratio: 74 dB

A common mode reject ratio of 74 dB indicates robust performance against common signal disturbances, enhancing accuracy in dual-signal applications.

Nominal Supply Voltage / Vsup (V): 1.8

A nominal supply voltage of 1.8V is energy-efficient, making it suitable for low-voltage applications.

Power Supplies (V): 1.8/5

The flexibility to operate at either 1.8V or 5V supplies allows for adaptability in a range of electronic designs.

No. of Terminals: 8

Having 8 terminals can accommodate more complex configurations while ensuring easy connection to other circuit components.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for saving space in compact electronic devices.

Maximum Supply Voltage Limit: 6 V

The 6 V maximum supply voltage limit provides a safe operational range while powering circuits that can operate efficiently at lower voltages.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this op amp is suitable for automotive and other demanding environments.

Maximum Bias Current (IIB) @25°C: 0.00001 uA

The ultra-low maximum bias current at 25 °C further ensures minimal interference with precision signals.

Frequency Compensation: YES

Integrated frequency compensation allows for stable operation in varying conditions and enhances performance in fast-switching applications.

Minimum Voltage Gain: 4470

A minimum voltage gain of 4470 provides the necessary amplification for weak signals, making it a strong choice for signal processing applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range of -40 °C makes this op amp reliable for use in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes enhance solder joint reliability, ensuring better connection quality for critical applications.

Terminal Position: DUAL

Dual terminal positioning improves accessibility and flexibility in circuit layout.

Maximum Seated Height: 1.75 mm

The compact height of 1.75 mm is advantageous for low-profile applications.

Width: 3.9 mm

A width of 3.9 mm allows for efficient space usage on the PCB.

Micropower: YES

Micropower specifications ensure low energy consumption, maximizing battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand up to 30 seconds at peak reflow temperature ensures compatibility with standard manufacturing processes.

Peak Reflow Temperature °C: 260

A reflow peak temperature of 260 °C allows for robust soldering performance suitable for mass production.

Length: 4.9 mm

A length of 4.9 mm contributes to the compactness of the package, facilitating design in space-constrained applications.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this op amp is built to withstand the rigors of automotive environments.

Low-Bias: YES

Low-bias characteristics make this op amp ideal for high-precision applications where signal integrity is crucial.

Nominal Unity Gain Bandwidth: 1100 kHz

A nominal unity gain bandwidth of 1100 kHz provides sufficient speed for many applications, ensuring responsiveness in signal processing.

Technology: CMOS

CMOS technology allows for low power consumption and high integration density, making it suitable for modern electronic devices.

Terminal Form: GULL WING

The gull wing terminal form offers ease of handling and soldering, which is crucial for assembly processes.

Amplifier Type: OPERATIONAL AMPLIFIER

Classified as an operational amplifier, this component is versatile for various amplification and signal processing applications.

Maximum Supply Current: 0.076 mA

Low maximum supply current of 0.076 mA contributes to energy efficiency, ideal for portable and battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is commonly used for versatile gain performance, enhancing usability across different applications.

Packing Method: TAPE AND REEL

Tape and reel packing method is efficient for automated assembly lines, ensuring ease of handling and accurate placement.

Nominal Slow Rate: 0.33 V/us

A nominal slew rate of 0.33 V/µs provides good response characteristics for many audio and instrumentation applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates easy PCB design while maintaining compatibility with standard manufacturing processes.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6292IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

4470

Nominal Slew Rate:

0.33 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

76 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV6292IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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