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TSV622ID

STMicroelectronics

TSV622ID by STMicroelectronics

TSV622ID by STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 6000 µV, a nominal voltage of 5 V, and an impressive common mode reject ratio of 80 dB. Ideal for automotive applications, it operates efficiently in temperatures from -40 °C to 125 °C. Its compact design and low bias current make it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,536 parts In-Stock

1+ parts

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5,536

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Digiode

USA . 4,551 parts In-Stock

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4,551

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Anansix

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 699 parts In-Stock

1+ parts

$6.779

100+ parts

-

1k+ parts

$6.101

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-

699

$6.779

-

$6.101

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Microchip USA

USA . 200 parts In-Stock

1+ parts

$12.280

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-

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200

$12.280

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MKK Technologies

India . 1,391 parts In-Stock

1+ parts

$12.747

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1,391

$12.747

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DigiPath Technology Company

USA . 1,391 parts In-Stock

1+ parts

$12.747

100+ parts

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1,391

$12.747

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AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$16.580

100+ parts

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508

$16.580

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A-Z Elektronik GmbH

Germany . 4,565 parts In-Stock

1+ parts

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4,565

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Vigor

Singapore . 4,500 parts In-Stock

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4,500

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Corphita

USA . 2,483 parts In-Stock

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2,483

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Parana Technologies

USA . 1,469 parts In-Stock

1+ parts

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$8.105

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1,469

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$8.105

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Overview

Elevate your designs with the TSV622ID operational amplifier from STMicroelectronics, a leader in semiconductor innovation. Renowned for reliability and precision, this micropower Op Amp excels in automotive applications, ensuring consistent performance even in extreme conditions. With low bias currents and high common mode rejection, it delivers exceptional accuracy, making it ideal for various signal processing tasks. Trust STMicroelectronics to elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Input Offset Voltage: 6000 uV

Low offset voltage ensures accurate signal amplification, minimizing errors.

Maximum Average Bias Current (IIB): 0.0001 uA

Very low bias current enhances precision in applications where power efficiency is crucial.

Surface Mount: YES

Surface mount design allows for compact and space-saving PCB layouts.

No. of Functions: 2

Dual functionality increases versatility and value for various circuit designs.

Package Shape: RECTANGULAR

Rectangular package shape optimizes layout flexibility on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

High CMRR improves the performance in noisy environments, making it suitable for precision applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage simplifies integration into common power systems.

Power Supplies (V): 1.8/5

Wide range of power supply options increases compatibility with various systems.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connection points for complex applications.

Package Style (Meter): SMALL OUTLINE

Small outline package allows for higher density designs on PCBs.

Minimum Slew Rate: 0.1 V/us

Sufficient slew rate for most basic signal processing tasks.

Maximum Supply Voltage Limit: 6 V

Flexible voltage limits expand its application range without damaging the component.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability in demanding environments.

Maximum Bias Current (IIB) @25°C: 0.00001 uA

Ultra-low bias current maintains operational accuracy in sensitive measurements.

Frequency Compensation: YES

Integrated frequency compensation ensures stability across frequency ranges.

Minimum Voltage Gain: 4470

High voltage gain allows for significant amplification of weaker signals.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it suitable for automotive and harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality finish enhances solder joint reliability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position improves layout flexibility and circuit design.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact component placement.

Width: 3.9 mm

Narrow width enables space-efficient PCB layouts.

Micropower: YES

Micropower operation maximizes battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow time helps maintain component integrity during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature compatibility ensures reliability in manufacturing processes.

Length: 4.9 mm

Compact length facilitates integration into smaller electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive grade certification ensures durability and performance in extreme conditions.

Low-Bias: YES

Low-bias characteristics enhance precision in sensitive electronic applications.

Nominal Unity Gain Bandwidth: 420 kHz

Adequate bandwidth supports a variety of analog signal processing needs.

Technology: CMOS

CMOS technology provides high-speed performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals enhance soldering ease and reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Standard op-amp configuration allows for broad applicability in circuit designs.

Maximum Supply Current: 0.076 mA

Very low supply current minimizes power consumption in battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture allows for high-performance linear amplification.

Nominal Slow Rate: 0.19 V/us

Adequate slow rate ensures controlled response times in signal processing.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates compatibility with various PCB designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSV622ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

420 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

4470

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.19 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

76 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV622ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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