Loading...

TSV6192IDT

STMicroelectronics

TSV6192IDT by STMicroelectronics

TSV6192IDT by STMicroelectronics is a dual operational amplifier with micropower consumption. It features a max input offset voltage of 5000 uV, nominal unity gain bandwidth of 380 kHz, and low-bias current at 0.000025 uA. Ideal for industrial applications requiring precise signal amplification in compact designs.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,729

-

-

-

-

Anansix

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,888

-

-

-

-

Bristol Electronics

USA . 2,415 parts In-Stock

1+ parts

-

100+ parts

$0.512

1k+ parts

$0.382

10k+ parts

$0.355

2,415

-

$0.512

$0.382

$0.355

Dan-Mar Components

USA . 2,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,415

-

-

-

-

Digiode

USA . 961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

961

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,422 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

-

10k+ parts

-

2,422

$0.570

-

-

-

IDEA Electronic Components Group

UK . 600 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

$1.737

10k+ parts

-

600

$1.930

-

$1.737

-

MKK Technologies

India . 1,751 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,751

$3.630

-

-

-

DigiPath Technology Company

USA . 1,751 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,751

$3.630

-

-

-

Microchip USA

USA . 4,002 parts In-Stock

1+ parts

$4.201

100+ parts

-

1k+ parts

-

10k+ parts

-

4,002

$4.201

-

-

-

Component Stockers USA

USA . 18,630 parts In-Stock

1+ parts

$7.110

100+ parts

-

1k+ parts

-

10k+ parts

-

18,630

$7.110

-

-

-

AZTECH Wire

Italy . 988 parts In-Stock

1+ parts

$8.610

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$8.610

-

-

-

RC Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,123

-

-

-

-

Perfect Parts

USA . 2,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,769

-

-

-

-

Corphita

USA . 2,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,279

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Parana Technologies

USA . 963 parts In-Stock

1+ parts

-

100+ parts

$2.308

1k+ parts

-

10k+ parts

-

963

-

$2.308

-

-

Overview

Unlock the potential of your electronic projects with the TSV6192IDT operational amplifiers from STMicroelectronics. Designed with precision and reliability in mind, these op amps offer unparalleled performance in a compact package. Whether you're working on audio equipment, sensor interfaces, or industrial control systems, the TSV6192IDT provides low bias current, micropower operation, and wide temperature tolerance for seamless integration into your designs. Trust in STMicroelectronics' expertise to deliver quality components that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage ensures accurate signal processing and minimal error in the output.

Maximum Average Bias Current (IIB): 0.000025 uA

Low bias current helps in maintaining stable operation and reducing power consumption.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Common Mode Reject Ratio: 71 dB

High common mode rejection ratio helps in rejecting noise and interference from input signals.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement makes it suitable for low power applications.

Maximum Supply Voltage Limit: 6 V

Wide supply voltage range allows for flexibility in different operating conditions.

Frequency Compensation: YES

Frequency compensation ensures stability and reliable performance over a wide range of frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and can be used in a wide range of applications such as signal conditioning and filtering.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6192IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

380 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

71 dB

Minimum Common Mode Rejection Ratio (CMRR ):

53 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

0.06 V/us

Peak Bias Current:

25 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

30 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV6192IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21