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TSV6191AILT

STMicroelectronics

TSV6191AILT by STMicroelectronics

TSV6191AILT by STMicroelectronics is a micropower operational amplifier with low bias current, offering a nominal unity gain bandwidth of 380 kHz. It operates at an industrial temperature grade range from -40 to 85 °C and features a voltage-feedback architecture. This Op Amp is suitable for applications requiring low-power consumption and precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,213 parts In-Stock

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4,213

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Digiode

USA . 2,583 parts In-Stock

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2,583

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Anansix

USA . 1,110 parts In-Stock

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1,110

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Distributors (Availability)

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Vigor

Singapore . 7,500 parts In-Stock

1+ parts

$0.520

100+ parts

-

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7,500

$0.520

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Microchip USA

USA . 5,035 parts In-Stock

1+ parts

$3.565

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5,035

$3.565

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IDEA Electronic Components Group

UK . 1,377 parts In-Stock

1+ parts

$4.086

100+ parts

-

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$3.677

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1,377

$4.086

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$3.677

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MKK Technologies

India . 2,060 parts In-Stock

1+ parts

$7.683

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2,060

$7.683

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DigiPath Technology Company

USA . 2,060 parts In-Stock

1+ parts

$7.683

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2,060

$7.683

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AZTECH Wire

Italy . 600 parts In-Stock

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$20.550

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600

$20.550

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Kepictronics

USA . 111,000 parts In-Stock

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111,000

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RC Electronics

USA . 27,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,959 parts In-Stock

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Perfect Parts

USA . 6,648 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Parana Technologies

USA . 1,577 parts In-Stock

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$4.885

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1,577

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$4.885

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Corphita

USA . 726 parts In-Stock

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726

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Overview

Elevate your projects with the TSV6191AILT operational amplifier by STMicroelectronics. Crafted with precision and expertise, this small yet powerful device offers unparalleled performance in a compact package. Ideal for industrial applications requiring low-bias operation and micropower consumption, this amplifier ensures optimal signal processing with minimal power consumption. Whether you're designing sensor networks or control systems, trust STMicroelectronics to deliver quality, reliability, and innovation in every component. Choose the TSV6191AILT for unmatched value and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and reliable housing for the operational amplifier.

Maximum Input Offset Voltage: 2000 uV

High input offset voltage helps in minimizing errors in amplifier circuits.

Nominal Common Mode Reject Ratio: 71 dB

High common mode rejection ratio ensures better rejection of noise and interference.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in saving power and making it suitable for low-power applications.

No. of Terminals: 5

Compact size with 5 terminals for easy integration into circuits.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for various environmental conditions.

Frequency Compensation: YES

Frequency compensation ensures stability of the amplifier over a wide range of frequencies.

Minimum Voltage Gain: 5000

High minimum voltage gain ensures amplification of weak signals with high fidelity.

Low-Bias: YES

Low bias current helps in reducing power consumption and improving accuracy of the amplifier circuit.

Nominal Unity Gain Bandwidth: 380 kHz

High unity gain bandwidth ensures high-speed operation of the amplifier.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6191AILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

380 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

71 dB

Minimum Common Mode Rejection Ratio (CMRR ):

53 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

0.06 V/us

Peak Bias Current:

25 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

15 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TSV6191AILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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