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TSM109N

STMicroelectronics

TSM109N by STMicroelectronics

TSM109N by STMicroelectronics is a dual comparator with a max input offset voltage of 9mV and operates within -40 °C to 105°C. It features low bias current (0.4µA) and supports supply voltages up to 36V, making it ideal for industrial applications. Its compact design ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,962 parts In-Stock

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Anansix

USA . 2,826 parts In-Stock

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Vyrian

USA . 2,504 parts In-Stock

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2,504

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 653 parts In-Stock

1+ parts

$3.755

100+ parts

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$3.380

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653

$3.755

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$3.380

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MKK Technologies

India . 817 parts In-Stock

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$7.062

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817

$7.062

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DigiPath Technology Company

USA . 817 parts In-Stock

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$7.062

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817

$7.062

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Parana Technologies

USA . 2,026 parts In-Stock

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$4.490

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$4.490

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Corphita

USA . 1,543 parts In-Stock

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Overview

Experience precision and reliability with the TSM109N comparator from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a versatile solution ideal for industrial applications where accuracy matters. With ultra-low bias current and robust temperature performance, this device ensures optimal operation in demanding environments, enhancing your designs' efficiency and longevity. Elevate your projects with trusted innovation that truly adds value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-lasting performance and reliability in various applications.

Maximum Input Offset Voltage: 9000 uV

A low input offset voltage enhances precision and accuracy in signal processing.

Maximum Average Bias Current (IIB): 0.4 uA

Low bias current minimizes power consumption, making it suitable for battery-powered devices.

No. of Functions: 2

Dual functionality provides flexibility in design, allowing for multiple applications in one device.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space efficiency on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Common supply voltage compatibility enhances integration with standard electronic systems.

Power Supplies (V): 2/36

Wide voltage range from 2V to 36V allows adaptability in diverse power environments.

No. of Terminals: 8

An 8-terminal configuration supports versatile connections, enabling complex circuit designs.

Package Style (Meter): IN-LINE

In-line package style simplifies assembly and integration into existing systems.

Maximum Supply Voltage Limit: 36 V

High voltage limit provides more design flexibility across various electronic applications.

Maximum Operating Temperature: 105 °C

High temperature rating ensures reliable operation in challenging environments.

Maximum Bias Current (IIB) @25 °C: 0.25 uA

Very low bias current at standard conditions supports low-power applications and efficiency.

Nominal Response Time: 1300 ns

Fast response time enhances performance in time-sensitive applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions increases reliability in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and improves the reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positioning supports efficient layout and routing in circuit designs.

Maximum Seated Height: 4.8 mm

Low seated height enables compact designs, ideal for space-constrained applications.

Width: 7.62 mm

Slim width facilitates integration into smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade components assure reliability and robustness in demanding applications.

Maximum Negative Supply Voltage Limit: 0 V

The zero limit for negative supply voltage ensures safe operation in standardized circuits.

Terminal Form: THROUGH-HOLE

Through-hole design offers stable mounting and better mechanical strength in circuit boards.

Amplifier Type: COMPARATOR

Comparator functionality allows for effective signal comparison and decision-making in circuits.

Maximum Supply Current: 2.5 mA

Low supply current requirement assists in conserving energy in battery-powered applications.

Nominal Negative Supply Voltage (Vsup): 0 V

The nominal negative supply voltage of 0V simplifies design considerations in signal processing.

Terminal Pitch: 2.54 mm

Standard terminal pitch aids in compatibility with existing PCB layouts and components.

Technical Specifications

Comparators TSM109N attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Power Supply:

2/36 V

Total Functions:

2

Sub-Category:

Comparators

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

2.5 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Nominal Response Time:

1.3 µs

Physical Characteristics

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.189 in (4.8 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

TSM109N Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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