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TSL6001ILT

STMicroelectronics

TSL6001ILT by STMicroelectronics

TSL6001ILT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 4500 µV and a nominal voltage of 5 V. It features a high common mode reject ratio of 74 dB, making it ideal for precision applications. Its compact design (2.9 mm x 1.6 mm) suits space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,888 parts In-Stock

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11,888

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Digiode

USA . 3,436 parts In-Stock

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3,436

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Anansix

USA . 1,945 parts In-Stock

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1,945

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$1.221

100+ parts

-

1k+ parts

$1.099

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1,390

$1.221

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$1.099

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Microchip USA

USA . 5,985 parts In-Stock

1+ parts

$2.157

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-

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5,985

$2.157

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MKK Technologies

India . 2,002 parts In-Stock

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$2.296

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2,002

$2.296

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DigiPath Technology Company

USA . 2,002 parts In-Stock

1+ parts

$2.296

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2,002

$2.296

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$18.050

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216

$18.050

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Parana Technologies

USA . 1,592 parts In-Stock

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$1.460

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1,592

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$1.460

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Corphita

USA . 386 parts In-Stock

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386

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Overview

Unlock precision and performance with the TSL6001ILT from STMicroelectronics, a leader in innovative technology. This micropower operational amplifier is designed for versatile applications, delivering outstanding quality and reliability that you can trust. Its compact size ensures easy integration into your designs while offering impressive efficiency and low bias currents. Elevate your projects and achieve peak performance with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials provides protection against environmental factors, ensuring the op amp operates reliably in various conditions.

Maximum Input Offset Voltage: 4500 uV

A maximum input offset voltage of 4500 uV allows for decent precision in applications where minimizing error is critical.

Surface Mount: YES

Being a surface mount device enables efficient use of PCB space and facilitates automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for a compact design, making it suitable for space-constrained applications.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode reject ratio enhances the performance by reducing unwanted noise, thereby improving signal integrity.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal supply voltage of 5 V makes it compatible with a wide range of low-voltage applications, ensuring versatility.

No. of Terminals: 5

With 5 terminals, this op amp offers flexibility for various configurations and can fit well in diverse circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style allows for low-profile mounting, ideal for compact devices and applications where height constraints are critical.

Maximum Supply Voltage Limit: 6 V

The maximum supply voltage limit of 6 V provides a safety margin for operational use in various circuits without risk of damage.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C allows for reliable performance in high-temperature environments, increasing its application range.

Frequency Compensation: YES

Frequency compensation ensures stability in feedback configurations, making this op amp suitable for precision applications.

Minimum Voltage Gain: 17782

A minimum voltage gain of 17782 guarantees enhanced amplification, suitable for weak signal processing.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this op amp is ideal for extreme environments, ensuring reliability in diverse applications.

Terminal Position: DUAL

The dual terminal position aids in easy layout routing and simplified PCB designs.

Maximum Seated Height: 1.45 mm

A low seated height of 1.45 mm is perfect for applications requiring space-saving components.

Width: 1.6 mm

The compact width of 1.6 mm further contributes to space-efficient PCB designs, enabling a smaller footprint.

Micropower: YES

Being a micropower device minimizes power consumption, making it ideal for battery-operated and energy-efficient applications.

Length: 2.9 mm

The short length of 2.9 mm allows integration into compact electronic systems, enhancing design possibilities.

Low-Bias: YES

Low-bias operation enhances stability and performance, particularly in sensitive applications.

Nominal Unity Gain Bandwidth: 1000 kHz

A nominal unity gain bandwidth of 1000 kHz provides sufficient frequency response for a variety of applications, ensuring versatility.

Minimum Common Mode Reject Ratio: 53 dB

A minimum common mode reject ratio of 53 dB offers good noise immunity, improving signal clarity in mixed signal environments.

Terminal Form: GULL WING

The gull wing terminal form enables easier soldering and assembly in tight spaces, ensuring reliability during the manufacturing process.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it can be utilized in a wide range of analog applications, including filtering, signal conditioning, and data acquisition.

Maximum Supply Current: 0.1 mA

With a maximum supply current of just 0.1 mA, this op amp is energy efficient, making it suitable for low-power applications.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture allows for a variety of circuit configurations, including inverting and non-inverting amplifiers.

Nominal Slow Rate: 0.4 V/µs

A nominal slow rate of 0.4 V/µs ensures manageable response times, making it suitable for many general-purpose applications.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch allows compatibility with standard PCB layouts, ensuring ease of integration into existing designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSL6001ILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

1

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Minimum Common Mode Rejection Ratio (CMRR ):

53 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

17782

Nominal Slew Rate:

0.4 V/us

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

100 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Standards

JESD-30 Code:

R-PDSO-G5

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TSL6001ILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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