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TSH94IYDT

STMicroelectronics

TSH94IYDT by STMicroelectronics

TSH94IYDT from STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 5 µV, a nominal CMRR of 100 dB, and operates within -40 °C to 125 °C. Ideal for automotive applications, it supports multiple supply voltages and offers high performance with a min gain of 500. Its compact design and surface mount capability make it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,656 parts In-Stock

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1,656

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Vyrian

USA . 968 parts In-Stock

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968

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Anansix

USA . 760 parts In-Stock

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760

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

1+ parts

$2.534

100+ parts

-

1k+ parts

$2.280

10k+ parts

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1,082

$2.534

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$2.280

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MKK Technologies

India . 494 parts In-Stock

1+ parts

$4.764

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494

$4.764

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DigiPath Technology Company

USA . 494 parts In-Stock

1+ parts

$4.764

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494

$4.764

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Parana Technologies

USA . 1,140 parts In-Stock

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$3.029

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1,140

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$3.029

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Corphita

USA . 257 parts In-Stock

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257

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Overview

Experience precision and reliability with the TSH94IYDT from STMicroelectronics, a premier name in operational amplifiers. Engineered for superior performance, this versatile 4-channel op-amp excels in diverse applications, from automotive systems to consumer electronics. Its exceptional low offset voltage and high common-mode rejection ratio ensure outstanding signal integrity. Choose the TSH94IYDT for unmatched quality, efficiency, and innovation that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental conditions, making it suitable for various applications.

Maximum Input Offset Voltage: 5 uV

A low input offset voltage ensures greater precision, making this op-amp ideal for applications requiring high accuracy.

Maximum Average Bias Current (IIB): 20 uA

Low bias current contributes to reduced power consumption, allowing for operation in energy-sensitive designs.

Surface Mount: YES

Surface mount packaging facilitates easier integration into compact circuit designs, offering space-saving advantages.

No. of Functions: 4

Multi-function capability provides flexibility for different design requirements, reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient layout and placement in tight PCB designs.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection enhances signal fidelity in noisy environments, making it suitable for sensitive analog applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard for many applications, ensuring easy integration without requiring extensive power supply design.

Power Supplies (V): +-3.5/+-6/7/12

Versatile supply voltage ranges enhance compatibility with various systems and applications.

No. of Terminals: 16

A 16-terminal configuration allows for comprehensive functionality and flexibility in connections, suitable for advanced circuitry.

Package Style (Meter): SMALL OUTLINE

Small outline packaging is ideal for space-constrained applications, providing a compact design solution.

Minimum Slew Rate: 0.07 V/us

A minimum slew rate ensures adequate response time for a variety of signal frequencies, contributing to performance in dynamic applications.

Maximum Supply Voltage Limit: 7 V

The maximum supply voltage limit allows for a wide range of applications, without risking component damage.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation in demanding environments, such as automotive applications.

Maximum Bias Current (IIB) @25°C: 15 uA

Reduced bias current at 25 °C improves accuracy and performance, beneficial in low-power designs.

Frequency Compensation: YES

Integrated frequency compensation simplifies design and enhances stability, reducing the need for external components.

Minimum Voltage Gain: 500

A minimum voltage gain of 500 provides excellent amplification capabilities, suitable for various signal processing tasks.

Minimum Operating Temperature: -40 °C

Low temperature operation expands application use in harsh environments, particularly in automotive and industrial sectors.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options, improving the design adaptability for various PCB layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height is advantageous for compact designs, aiding in space optimization on PCBs.

Width: 3.9 mm

Compact width allows for placement in denser circuitry, making it suitable for modern electronic devices.

Length: 9.9 mm

Short length is beneficial for minimizing space on PCBs, enabling more components to be integrated.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures reliability and robustness for applications in challenging environments, essential for vehicle electronics.

Maximum Negative Supply Voltage Limit: -7 V

Allows for flexibility in circuit configurations requiring negative voltage supplies, enhancing design options.

Nominal Unity Gain Bandwidth: 150000 kHz

A high unity gain bandwidth allows for effective handling of a wide range of frequencies, suitable for high-speed applications.

Technology: BIPOLAR

Bipolar technology offers superior performance characteristics, including better linearity and faster response times.

Terminal Form: GULL WING

Gull wing terminals facilitate effective soldering with better access, ensuring reliable connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components used in a variety of applications, making this a practical choice.

Maximum Supply Current: 32 mA

Moderate supply current allows for efficient operation without excessive energy consumption, beneficial for portable devices.

Nominal Negative Supply Voltage (Vsup): -5 V

A nominal negative supply voltage enhances flexibility in applications requiring dual polarity supplies.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers simplicity and versatility, ideal for different circuit configurations.

Packing Method: TAPE AND REEL

Tape and reel packing makes automated assembly easier, enhancing manufacturing efficiency and reducing labor costs.

Nominal Slow Rate: 110 V/us

The slow rate ensures adequate handling of fast signals, suitable for a range of high-speed applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch enhances compatibility with existing PCB layouts, simplifying integration.

Wideband: YES

Wideband capability enables the op-amp to handle a wide frequency spectrum, making it suitable for various high-performance applications.

Technical Specifications

Operational Amplifiers (Op Amps) TSH94IYDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±3.5/±6/7/12 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Wideband:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

150 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

5 uV

Minimum Voltage Gain:

500

Minimum Slew Rate:

0.07 V/us

Nominal Slew Rate:

110 V/us

Peak Bias Current:

20 uA

Maximum Bias Current (IIB) @25 °C:

15 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

32 mA

Physical Characteristics

Length:

0.39 in (9.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP16,.25

Trade Compliance

TSH94IYDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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