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TSH346IDT

STMicroelectronics

TSH346IDT by STMicroelectronics

TSH346IDT by STMicroelectronics is a dual buffer amplifier with a nominal voltage of 5V and a bandwidth of 36 MHz. It features low bias current (3.6 µA) and operates in extreme temperatures from -40 °C to 85 °C, ideal for industrial applications. Its compact SO8 package ensures efficient surface mounting.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 17 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

-

10k+ parts

$0.640

17

$1.350

-

-

$0.640

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,917 parts In-Stock

1+ parts

$1.282

100+ parts

-

1k+ parts

-

10k+ parts

-

4,917

$1.282

-

-

-

Vyrian

USA . 2,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,414

-

-

-

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Anansix

USA . 291 parts In-Stock

1+ parts

-

100+ parts

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291

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,086 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

-

10k+ parts

-

1,086

$1.215

-

-

-

Component Stockers USA

USA . 18 parts In-Stock

1+ parts

$1.560

100+ parts

-

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-

10k+ parts

-

18

$1.560

-

-

-

Vigor

Singapore . 2,392 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

-

2,392

$1.650

-

-

-

IDEA Electronic Components Group

UK . 2,176 parts In-Stock

1+ parts

$3.234

100+ parts

-

1k+ parts

$2.910

10k+ parts

-

2,176

$3.234

-

$2.910

-

MKK Technologies

India . 219 parts In-Stock

1+ parts

$6.081

100+ parts

-

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-

10k+ parts

-

219

$6.081

-

-

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DigiPath Technology Company

USA . 219 parts In-Stock

1+ parts

$6.081

100+ parts

-

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219

$6.081

-

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Microchip USA

USA . 6,883 parts In-Stock

1+ parts

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6,883

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A-Z Elektronik GmbH

Germany . 6,588 parts In-Stock

1+ parts

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6,588

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Perfect Parts

USA . 4,413 parts In-Stock

1+ parts

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4,413

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Kepictronics

USA . 3,910 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,910

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-

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

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Parana Technologies

USA . 1,341 parts In-Stock

1+ parts

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100+ parts

$3.866

1k+ parts

-

10k+ parts

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1,341

-

$3.866

-

-

Overview

Experience unparalleled performance with the TSH346IDT from STMicroelectronics, a leader in innovative semiconductor solutions. This precision buffer amplifier promises exceptional reliability and efficiency for your electronic designs, operating seamlessly in demanding environments. With low bias current and robust thermal stability, it's ideal for industrial applications where quality counts. Elevate your projects with ST's commitment to excellence and unlock unmatched value for your next design!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight characteristics, making the amplifier suitable for various applications.

Maximum Average Bias Current (IIB): 3.6 uA

A low average bias current allows for efficient operation, minimizing power consumption which is ideal for battery-powered and energy-sensitive applications.

Surface Mount: YES

Surface mount capability facilitates easier integration into modern PCB designs, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space utilization on the circuit board, allowing for more compact designs.

Nominal Supply Voltage / Vsup (V): 5

Designed to operate at a nominal voltage of 5V, this amplifier can easily interface with common power supplies and circuits.

Power Supplies (V): 5

Versatile power supply options support integrated systems where 5V is a standard operating voltage.

No. of Terminals: 8

Having 8 terminals allows for flexible connectivity and integration in various designs, ensuring compatibility with different circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, allowing for high-density component layout.

Maximum Supply Voltage Limit: 6 V

With a maximum supply voltage of 6V, this amplifier can handle slight variances in power supply, enhancing reliability.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C ensures the amplifier can function in demanding environments without performance degradation.

Maximum Bias Current (IIB) @25°C: 3.6 uA

This specification at 25 °C reinforces the amplifier's efficient biasing characteristics, supporting low-power applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C expands the range of applications, particularly in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finishes improve reliability and solderability, contributing to better performance in circuit connections.

Terminal Position: DUAL

Dual terminal position enables more flexible circuit board layouts and connections, enhancing design versatility.

Maximum Seated Height: 1.75 mm

A low seated height allows for designs with stringent height restrictions, making it suitable for compact electronic devices.

Width: 3.9 mm

The compact width of 3.9 mm makes it a great choice for portable and space-constrained applications.

Nominal Bandwidth (3dB): 36 MHz

A nominal bandwidth of 36 MHz indicates high-speed performance, suitable for a variety of applications requiring fast signal processing.

Maximum Time At Peak Reflow Temperature (s): 40

With a peak reflow tolerance of 40 seconds, this amplifier can withstand standard soldering processes while maintaining performance.

Peak Reflow Temperature °C: 260

Designed to endure high peak reflow temperatures, ensuring robust assembly without compromising component integrity.

Length: 4.9 mm

The compact length of 4.9 mm makes it suitable for designs where space is at a premium.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the amplifier can be used in a variety of harsh conditions, increasing its application scope.

Terminal Form: GULL WING

Gull wing terminals provide a strong mechanical connection, enhancing reliability during operation and soldering.

Amplifier Type: BUFFER

As a buffer amplifier, it effectively isolates stages in a circuit, allowing for signal integrity and preventing load effects.

Maximum Supply Current: 51.6 mA

A maximum supply current of 51.6 mA supports higher output capabilities, making it suitable for demanding applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this amplifier can fit into tightly packed designs, enhancing layout flexibility.

Minimum Output Current: 0.076 A

A minimum output current of 0.076 A allows for sufficient drive capability, handling a variety of load conditions.

Technical Specifications

Buffer Amplifiers TSH346IDT attributes and parameters. Explore more Buffer Amplifiers devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Power Supply:

5 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

36 MHz

Peak Bias Current:

3.6 uA

Maximum Bias Current (IIB) @25 °C:

3.6 uA

Operational Characteristics

Maximum Supply Current:

51.6 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Output Current:

76 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

40 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH346IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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