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TSC214IYQT

STMicroelectronics

TSC214IYQT by STMicroelectronics

TSC214IYQT by STMicroelectronics is a low-offset operational amplifier ideal for automotive applications, featuring a max input offset voltage of 60 µV and a common mode reject ratio of 120 dB. It operates within -40 °C to 125 °C and supports a supply voltage up to 26 V. Its compact design with a very thin profile makes it suitable for space-constrained environments.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,565 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

25,565

-

$1.390

$1.150

$1.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,221 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

2,221

$1.064

-

-

-

Vyrian

USA . 9,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,850

-

-

-

-

Anansix

USA . 1,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,624

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,492 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

4,492

$1.008

-

-

-

IDEA Electronic Components Group

UK . 796 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

$2.308

10k+ parts

-

796

$2.565

-

$2.308

-

MKK Technologies

India . 1,525 parts In-Stock

1+ parts

$4.823

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$4.823

-

-

-

DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

$4.823

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$4.823

-

-

-

Microchip USA

USA . 5,816 parts In-Stock

1+ parts

$8.080

100+ parts

-

1k+ parts

-

10k+ parts

-

5,816

$8.080

-

-

-

AZTECH Wire

Italy . 1,191 parts In-Stock

1+ parts

$9.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$9.750

-

-

-

Parana Technologies

USA . 2,372 parts In-Stock

1+ parts

-

100+ parts

$3.067

1k+ parts

-

10k+ parts

-

2,372

-

$3.067

-

-

Overview

Unlock precision and reliability with the TSC214IYQT from STMicroelectronics, a leader in semiconductor innovation. This operational amplifier combines exceptional low-offset voltage and outstanding common mode rejection for superior performance in automotive, industrial, and consumer applications. Designed to thrive in extreme conditions, its micropower consumption ensures efficiency without compromising quality. Experience unmatched value and elevate your projects with ST’s trusted technology today!

Feature Benefit Bullets

Maximum Input Offset Voltage: 60 µV

A low input offset voltage ensures precision in the amplification and minimizes error, making it ideal for sensitive applications.

Maximum Average Bias Current (IIB): 35 µA

Low bias current results in better accuracy and reduced offset errors, enhancing overall performance, especially in low-power applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes, suited for modern manufacturing.

Screening Level: AEC-Q100

Compliance with automotive standards ensures reliability and durability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

A rectangular package shape supports various layout configurations, aiding in flexible design options for engineers.

Nominal Common Mode Reject Ratio: 120 dB

A high common mode rejection ratio improves noise immunity and signal integrity, essential for precise signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage ensures compatibility with many systems and simplifies design considerations.

No. of Terminals: 10

A 10-terminal package provides ample connection points for diverse applications, enhancing adaptability in various circuits.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

A thin profile package optimizes space usage on PCBs, crucial for compact and portable electronic devices.

Maximum Supply Voltage Limit: 26 V

Supporting a high supply voltage offers flexibility for various applications while ensuring stability in operation.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in demanding environments, making it versatile for different applications.

Maximum Bias Current (IIB) @25°C: 35 µA

Consistent bias characteristics at various temperatures enhance performance predictability in real-world applications.

Frequency Compensation: YES

Built-in frequency compensation helps to stabilize the operation of the amplifier, assuring performance in feedback applications.

Minimum Operating Temperature: -40 °C

Operating in sub-zero environments expands the range of applications in harsh conditions typical in industrial and automotive settings.

Terminal Finish: TIN

Tin terminal finish offers good solderability and is conducive to reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal positioning provides convenient layout options for circuit design, improving overall space optimization.

Low-Offset: YES

The low offset feature indicates high accuracy and quality in signal amplification, critical for accurate data acquisition.

Maximum Seated Height: 0.8 mm

A low seated height allows for integration into tighter spaces, enhancing design flexibility in compact devices.

Width: 1.4 mm

Narrow width is beneficial for high-density PCB designs, enabling more components to fit into reduced spaces.

Micropower: YES

Micropower operation not only reduces power consumption but extends operational life in battery-powered applications.

Peak Reflow Temperature: 260 °C

Resistance to high temperatures during manufacturing ensures reliability and durability within the assembly process.

Length: 1.8 mm

A compact length along with the small footprint supports high-density designs, enabling miniaturization of electronic circuits.

Nominal Unity Gain Bandwidth: 56.4 kHz

Adequate bandwidth facilitates versatility in applications requiring varying frequency ranges, enhancing design flexibility.

Minimum Common Mode Reject Ratio: 100 dB

Even at lower specifications, a minimum common mode rejection ratio maintains improved performance against noise interference.

Terminal Form: NO LEAD

Leadless terminal design supports better thermal performance and allows for more efficient soldering processes.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components used in myriad applications from signal processing to active filtering.

Maximum Supply Current: 0.115 mA

Low supply current minimizes overall power consumption, making it perfect for energy-efficient designs.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely used for various circuits, providing stability and ease of implementation.

Packing Method: TR

The TR packing method ensures adherence to space-saving designs and compatibility with automated assembly systems.

Nominal Slow Rate: 0.32 V/µs

A reasonable slew rate supports the amplifier's ability to respond to rapid signal changes, vital for dynamic applications.

Terminal Pitch: 0.4 mm

A small terminal pitch accommodates denser PCB layouts, crucial for contemporary electronics.

Technical Specifications

Operational Amplifiers (Op Amps) TSC214IYQT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

1

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

56.4 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

120 dB

Minimum Common Mode Rejection Ratio (CMRR ):

100 dB

Input Offset Voltage Limit:

60 uV

Nominal Slew Rate:

0.32 V/us

Peak Bias Current:

35 uA

Maximum Bias Current (IIB) @25 °C:

35 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

26 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

115 μA

Physical Characteristics

Length:

0.071 in (1.8 mm)

Width:

0.055 in (1.4 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Total Terminals:

10

Terminal Pitch:

0.016 in (0.4 mm)

Terminal Position:

Quad

Terminal Form:

Terminal Finish:

Tin

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-XQCC-N10

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Chip Carrier, Very Thin Profile

Package Equivalence Code:

LCC10,.06X.07,16

Trade Compliance

TSC214IYQT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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