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TSC210IYQT

STMicroelectronics

TSC210IYQT by STMicroelectronics

TSC210IYQT by STMicroelectronics is a low-offset operational amplifier ideal for automotive applications, featuring a max input offset voltage of 35 µV and a common mode reject ratio of 140 dB. It operates within -40 °C to 125 °C and supports supply voltages up to 26 V. Its compact design (1.8 mm x 1.4 mm) ensures efficient use in space-constrained environments.

Median Price

$1.390

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 150 parts In-Stock

1+ parts

$1.498

100+ parts

$1.202

1k+ parts

$1.125

10k+ parts

-

150

$1.498

$1.202

$1.125

-

Rochester

USA . 24,963 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

24,963

-

$1.390

$1.150

$1.030

Verical

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$1.202

1k+ parts

$1.125

10k+ parts

-

150

-

$1.202

$1.125

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,477 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

2,477

$1.064

-

-

-

Vyrian

USA . 4,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,287

-

-

-

-

Anansix

USA . 2,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,731

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,602 parts In-Stock

1+ parts

$0.847

100+ parts

-

1k+ parts

$0.763

10k+ parts

-

1,602

$0.847

-

$0.763

-

Corphita

USA . 2,513 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

2,513

$1.008

-

-

-

MKK Technologies

India . 1,081 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

$1.593

-

-

-

DigiPath Technology Company

USA . 1,081 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

$1.593

-

-

-

Microchip USA

USA . 5,301 parts In-Stock

1+ parts

$8.080

100+ parts

-

1k+ parts

-

10k+ parts

-

5,301

$8.080

-

-

-

AZTECH Wire

Italy . 1,013 parts In-Stock

1+ parts

$8.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,013

$8.410

-

-

-

Component Stockers USA

USA . 2,160 parts In-Stock

1+ parts

$15.630

100+ parts

-

1k+ parts

-

10k+ parts

-

2,160

$15.630

-

-

-

Parana Technologies

USA . 1,116 parts In-Stock

1+ parts

-

100+ parts

$1.013

1k+ parts

-

10k+ parts

-

1,116

-

$1.013

-

-

Overview

Elevate your designs with the TSC210IYQT from STMicroelectronics, a leader in innovative semiconductor solutions. This operational amplifier blends exceptional low-offset performance and ultra-low power consumption, ensuring reliability across automotive and industrial applications. With its AEC-Q100 qualification, you can trust its durability under extreme conditions. Experience unmatched precision and efficiency—perfect for engineers seeking quality without compromise!

Feature Benefit Bullets

Maximum Input Offset Voltage: 35 uV

Low input offset voltage ensures high accuracy in signal processing, making this Op Amp ideal for precision applications.

Maximum Average Bias Current (IIB): 35 uA

Low bias current minimizes power consumption, which is beneficial for battery-operated devices.

Surface Mount: YES

Surface mount compatibility allows for compact designs and automated assembly, enhancing manufacturability.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards ensures robustness and reliability in automotive and industrial environments.

Package Shape: RECTANGULAR

Rectangular packaging contributes to efficient use of PCB space.

Nominal Common Mode Reject Ratio: 140 dB

High common mode rejection ratio improves noise rejection, essential for accurate signal amplification in noisy environments.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage makes the Op Amp compatible with various low-power applications.

No. of Terminals: 10

A sufficient number of terminals allows for versatile connections and enhanced functionality in circuit designs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile ensures compatibility with space-constrained designs, promoting slim device architecture.

Maximum Supply Voltage Limit: 26 V

A high supply voltage limit expands the range of possible applications, including those requiring high-voltage environments.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for use in demanding environments, enhancing reliability.

Maximum Bias Current (IIB) @25°C: 35 uA

Low bias current at nominal temperature further reduces power consumption, beneficial for thermal management.

Frequency Compensation: YES

Built-in frequency compensation ensures stable operation across a range of frequencies, improving user experience.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it reliable for extreme environmental conditions.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility, making circuit design easier.

Low-Offset: YES

Low-offset design enhances precision in signal processing, making it suitable for sensitive applications.

Maximum Seated Height: 0.8 mm

Low seated height facilitates integration into compact devices and systems.

Width: 1.4 mm

Compact width allows for denser placement on PCBs without compromising performance.

Micropower: YES

Micropower consumption is ideal for energy-efficient designs, particularly in battery-operated devices.

Length: 1.8 mm

Small length contributes to a smaller overall footprint, making it suitable for innovative applications.

Nominal Unity Gain Bandwidth: 35.25 kHz

A sufficient unity gain bandwidth allows for effective signal amplification in a variety of applications.

Minimum Common Mode Reject Ratio: 105 dB

Even at its minimum, the common mode rejection ratio assures decent noise performance for many applications.

Terminal Form: NO LEAD

No lead design simplifies manufacturing and ensures compatibility with modern assembly techniques.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile and suitable for various analog signal processing tasks.

Maximum Supply Current: 0.115 mA

Low supply current consumption is advantageous for battery life and overall system efficiency.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures high performance and stability in various feedback configurations.

Packing Method: TR

Tape and reel packing facilitates easy handling and automatic placement during assembly.

Nominal Slow Rate: 0.2 V/us

Moderate slow rate allows for controlled application of signals, important for signal integrity.

Terminal Pitch: 0.4 mm

A fine terminal pitch enables dense packing of components on PCBs, maximizing component density.

Technical Specifications

Operational Amplifiers (Op Amps) TSC210IYQT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Total Functions:

1

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

35.25 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

140 dB

Minimum Common Mode Rejection Ratio (CMRR ):

105 dB

Input Offset Voltage Limit:

35 uV

Nominal Slew Rate:

0.2 V/us

Peak Bias Current:

35 uA

Maximum Bias Current (IIB) @25 °C:

35 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

26 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

115 μA

Physical Characteristics

Length:

0.071 in (1.8 mm)

Width:

0.055 in (1.4 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Total Terminals:

10

Terminal Pitch:

0.016 in (0.4 mm)

Terminal Position:

Quad

Terminal Form:

Surface Mount:

Yes

Manufacturing and Reliability

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-XQCC-N10

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Chip Carrier, Very Thin Profile

Package Equivalence Code:

LCC10,.06X.07,16

Trade Compliance

TSC210IYQT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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