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TS339CN

STMicroelectronics

TS339CN by STMicroelectronics

STMicroelectronics' TS339CN is a CMOS comparator with 4 functions, 6500uV max input offset voltage, and 0.0006uA max average bias current. Ideal for applications requiring precise voltage comparisons in commercial temperature environments.

Median Price

$1.097

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 9,000 parts In-Stock

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Vyrian

USA . 6,198 parts In-Stock

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R&J Components

USA . 1,000 parts In-Stock

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Anansix

USA . 736 parts In-Stock

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Digiode

USA . 485 parts In-Stock

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Lakeland Logistics Inc

USA . 300 parts In-Stock

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Bristol Electronics

USA . 300 parts In-Stock

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$1.097

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$1.024

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300

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$1.097

$1.024

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ECAB

Sweden . 228 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 75 parts In-Stock

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Dan-Mar Components

USA . 75 parts In-Stock

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Q Components

USA . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$3.462

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$3.116

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MKK Technologies

India . 707 parts In-Stock

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$6.510

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$6.510

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DigiPath Technology Company

USA . 707 parts In-Stock

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$6.510

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AZTECH Wire

Italy . 959 parts In-Stock

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$20.860

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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RC Electronics

USA . 19,800 parts In-Stock

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Microchip USA

USA . 4,040 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,261 parts In-Stock

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Vigor

Singapore . 2,310 parts In-Stock

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Metaverse IC Inc.

Canada . 1,900 parts In-Stock

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Perfect Parts

USA . 1,456 parts In-Stock

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Parana Technologies

USA . 1,038 parts In-Stock

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$4.139

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Assy Fe

Spain . 975 parts In-Stock

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Corphita

USA . 864 parts In-Stock

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Overview

Elevate your circuits with the TS339CN by STMicroelectronics, a high-quality comparator perfect for a wide range of applications. With its advanced technology and reliable performance, this product exemplifies the excellence of its manufacturer. Experience the benefits of fast response times, low power consumption, and precise output control in a compact package that maximizes efficiency. Trust STMicroelectronics to provide you with the tools you need to succeed in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various operating conditions, making it a good choice for long-term use.

Maximum Input Offset Voltage: 6500 uV

Having a high maximum input offset voltage allows for a wider range of input signals to be accurately detected, increasing the versatility of the comparator.

Maximum Average Bias Current (IIB): 0.0006 uA

The low average bias current helps in reducing power consumption and improves the overall efficiency of the comparator.

No. of Functions: 4

With multiple functions available, this comparator can handle complex tasks efficiently and effectively.

Nominal Supply Voltage / Vsup (V): 3

Having a nominal supply voltage of 3V makes it compatible with a wide range of systems and applications.

Power Supplies (V): 5

Having multiple power supply options allows for flexibility in powering the comparator depending on the requirements of the system.

Output Type: OPEN-DRAIN

The open-drain output type allows for more flexibility in the design and connection of the comparator with other components.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it an excellent choice for energy-efficient and reliable operation.

Technical Specifications

Comparators TS339CN attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Maximum Supply Current:

100 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Nominal Response Time:

1.5 µs

Physical Characteristics

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.201 in (5.1 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TS339CN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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