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TS3022ID

STMicroelectronics

TS3022ID by STMicroelectronics

STMicroelectronics' TS3022ID is a comparator with 2 functions, operating at -40 to 125 °C. Features include 10000 uV max input offset voltage, 0.3 uA max average bias current, and push-pull output type. Ideal for automotive applications due to its small outline package style and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,514 parts In-Stock

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5,514

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Digiode

USA . 4,165 parts In-Stock

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4,165

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A&K Electronics

USA . 557 parts In-Stock

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557

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Rotakorn

Sweden . 557 parts In-Stock

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557

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Bristol Electronics

USA . 557 parts In-Stock

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557

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Anansix

USA . 289 parts In-Stock

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289

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 542 parts In-Stock

1+ parts

$2.277

100+ parts

-

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$2.049

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542

$2.277

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$2.049

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MKK Technologies

India . 1,237 parts In-Stock

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$4.282

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1,237

$4.282

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DigiPath Technology Company

USA . 1,237 parts In-Stock

1+ parts

$4.282

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1,237

$4.282

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AZTECH Wire

Italy . 342 parts In-Stock

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$10.320

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342

$10.320

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Microchip USA

USA . 313 parts In-Stock

1+ parts

$21.024

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313

$21.024

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,817 parts In-Stock

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Parana Technologies

USA . 243 parts In-Stock

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$2.722

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243

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$2.722

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Overview

Experience unmatched precision and reliability with the TS3022ID by STMicroelectronics, a leading manufacturer in the industry. This versatile comparator offers superior performance and accuracy for a wide range of applications. Whether you are designing automotive systems, industrial equipment, or consumer electronics, this compact device delivers exceptional value and efficiency. Trust STMicroelectronics to provide cutting-edge technology that exceeds your expectations. Elevate your projects with the TS3022ID and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making the product suitable for a variety of environments.

Maximum Input Offset Voltage: 10000 uV

High maximum input offset voltage allows for accurate comparisons between input signals, ensuring reliable performance.

Maximum Average Bias Current (IIB): 0.3 uA

Low average bias current helps in minimizing power consumption and improving efficiency of the comparator.

Surface Mount: YES

Surface mount capability enables easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions allows the comparator to perform different operations simultaneously, enhancing its versatility.

Nominal Supply Voltage / Vsup (V): 2

Stable nominal supply voltage ensures consistent performance of the comparator within a specified range of operation.

Maximum Supply Current: 0.135 mA

Low maximum supply current helps in reducing power consumption and heat dissipation, contributing to energy efficiency.

Technical Specifications

Comparators TS3022ID attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

300 nA

Maximum Bias Current (IIB) @25 °C:

160 nA

Operational Characteristics

Maximum Supply Current:

135 μA

Nominal Supply Voltage:

2 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

42 ns

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS3022ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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