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TDE1707DFT

STMicroelectronics

TDE1707DFT by STMicroelectronics

TDE1707DFT by STMicroelectronics is a versatile power distribution switch with a 1:2 input-output ratio, supporting loads from 6V to 48V. It features dual outputs with a max current of 500mA and includes fault protection mechanisms. Ideal for surface mount applications, it operates in -25 °C to 85°C range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,229 parts In-Stock

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11,229

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Pegasus Components GmbH

Germany . 3,978 parts In-Stock

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3,978

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Digiode

USA . 2,790 parts In-Stock

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2,790

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Anansix

USA . 2,419 parts In-Stock

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2,419

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Distributors (Availability)

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AZTECH Wire

Italy . 1,023 parts In-Stock

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$11.740

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1,023

$11.740

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Microchip USA

USA . 284 parts In-Stock

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$119.457

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284

$119.457

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QUARKTWIN TECHNOLOGY LTD

USA . 15,079 parts In-Stock

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15,079

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Perfect Parts

USA . 10,063 parts In-Stock

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10,063

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Corphita

USA . 4,681 parts In-Stock

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4,681

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

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1,792

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MKK Technologies

India . 410 parts In-Stock

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410

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DigiPath Technology Company

USA . 410 parts In-Stock

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410

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Parana Technologies

USA . 204 parts In-Stock

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Overview

Elevate your designs with the TDE1707DFT from STMicroelectronics—a powerhouse in power management solutions. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile IC that effortlessly handles load driving and power distribution tasks across various applications. Enjoy unmatched reliability and efficiency, backed by robust fault protection features. Optimize performance and ensure longevity in your projects with this advanced component.

Feature Benefit Bullets

Other Names - 497-5169-6, 497-5169-2, 497-5169-1, 1805-TDE1707DFTCT, 1805-TDE1707DFTTR, -497-5169-1, -497-5169-2, 1805-TDE1707DFTDKR, 497-5169-6

A comprehensive list of alternative names allows for easy identification and compatibility with various systems and applications.

Standard Package - 4,500

High packing density means reduced storage space and potentially lower transportation costs, making it cost-effective for mass production.

Category - Integrated Circuits (ICs) / Power Management (PMIC) / Power Distribution Switches, Load Drivers

Specialized in power management, thus ensuring reliability and efficiency in power distribution, which is critical in modern electronic designs.

Packaging - Tape & Reel (TR)

Facilitates automated assembly processes, improving manufacturing efficiency and reducing labor costs.

Number of Outputs - 2

Two outputs provide flexibility in circuit design and can effectively drive multiple load applications simultaneously.

Ratio - Input:Output - 1:2

A dual ratio configuration allows for versatile applications, making it suitable for various load types while maintaining performance.

Output Configuration - High Side or Low Side

Versatile output configuration offers adaptability in circuit designs, meeting diverse application requirements.

Output Type - Bipolar

Bipolar output type enables better performance characteristics in certain applications, providing a robust solution for power management.

Interface - On/Off

Simplified control interface makes the product easy to integrate into existing systems, enhancing user-friendliness.

Voltage - Load - 6V ~ 48V

Wide operating voltage range accommodates various applications, from consumer electronics to industrial systems.

Current - Output (Max) - 500mA

Sufficient output current capability meets the demands of many load types, ensuring reliability in performance.

Input Type - Non-Inverting

Non-inverting input type simplifies design configurations and ensures predictable circuit behavior.

Features - 5V Regulated Output

Integrated 5V output adds utility and convenience for powering additional components, improving system integration.

Fault Protection - Current Limiting (Fixed), Over Temperature, Reverse Current

Comprehensive fault protection mechanisms enhance reliability and safety, making this product suitable for demanding environments.

Operating Temperature - -25 °C ~ 85°C (TA)

Wide temperature operating range ensures performance in various environments, ideal for both consumer and industrial applications.

Mounting Type - Surface Mount

Surface mount design offers space savings and compatibility with automated assembly, streamlining production processes.

Supplier Device Package - 8-DFN (4x4)

Compact package size optimizes PCB space usage while maintaining performance and functionality, suitable for modern, space-constrained designs.

Package / Case - 8-VDFN Exposed Pad

Exposed pad design enhances thermal dissipation, ensuring reliability under varying operational conditions.

Base Product Number - TDE1707

The base product number allows for easy referencing and cross-comparison with similar products within the lineup.

Moisture Sensitivity Level (MSL) - 1 (Unlimited)

With no restrictions on moisture exposure, this product enhances flexibility in handling and storage during manufacturing.

Technical Specifications

Additional Parts TDE1707DFT attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

-497-5169-6
497-5169-2
497-5169-1
1805-TDE1707DFTCT
1805-TDE1707DFTTR
-497-5169-1
-497-5169-2
1805-TDE1707DFTDKR
497-5169-6

Operating Temperature:

-25°C ~ 85°C (TA)

Input Type:

Non-Inverting

Category:

Integrated Circuits (ICs)
Power Management (PMIC) Power Distribution Switches, Load Drivers

Output Type:

Bipolar

Switch Type:

General Purpose

Output Configuration:

High Side or Low Side

Ratio - Input:Output:

1:2

Voltage - Load:

6V ~ 48V

Mounting Type:

Surface Mount

Current - Output (Max):

500mA

Supplier Device Package:

8-DFN (4x4)

Standard Package:

4,500

Number of Outputs:

2

Fault Protection:

Current Limiting (Fixed), Over Temperature, Reverse Current

Package / Case:

8-VDFN Exposed Pad

Packaging:

Tape & Reel (TR)

Features:

5V Regulated Output

Voltage - Supply (Vcc/Vdd):

Not Required

Interface:

On/Off

Base Product Number:

TDE1707

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TDE1707DFT Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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