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TDA7801PD

STMicroelectronics

TDA7801PD by STMicroelectronics

TDA7801PD from STMicroelectronics is a Class AB audio amplifier featuring 4 channels and operates on a power supply of 14.4V. It boasts a harmonic distortion of just 10% and can withstand temperatures from -40 °C to 105°C. Ideal for automotive audio applications, it comes in a compact surface-mount package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,635 parts In-Stock

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7,635

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Digiode

USA . 3,133 parts In-Stock

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3,133

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Anansix

USA . 339 parts In-Stock

1+ parts

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339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,102 parts In-Stock

1+ parts

$0.839

100+ parts

-

1k+ parts

$0.755

10k+ parts

-

1,102

$0.839

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$0.755

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MKK Technologies

India . 669 parts In-Stock

1+ parts

$1.578

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669

$1.578

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DigiPath Technology Company

USA . 669 parts In-Stock

1+ parts

$1.578

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669

$1.578

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AZTECH Wire

Italy . 89 parts In-Stock

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$17.710

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89

$17.710

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Microchip USA

USA . 2,487 parts In-Stock

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$27.630

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2,487

$27.630

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Corphita

USA . 4,569 parts In-Stock

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4,569

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Parana Technologies

USA . 907 parts In-Stock

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$1.003

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907

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$1.003

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Overview

Elevate your audio experience with the TDA7801PD from STMicroelectronics, a premier choice for audio and video amplifiers. Renowned for reliability and innovation, STMicroelectronics delivers this Class AB amplifier designed for superior sound quality and efficiency. With its compact size and robust thermal performance, it's perfect for automotive and industrial applications. Enjoy crystal-clear audio while benefiting from enhanced durability and seamless integration into your systems. Choose TDA7801PD for unparalleled sound excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device (SMD) allows for easier integration into compact circuits, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB space utilization, allowing for dense circuit layouts.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB design offers a good balance between sound quality and power efficiency, making it ideal for high-performance audio applications.

Harmonic Distortion: 10 %

With only 10% harmonic distortion, the amplifier provides clear and high-fidelity sound quality.

Power Supplies (V): 14.4

The operating voltage of 14.4V supports a wide range of audio applications while ensuring optimal performance.

No. of Terminals: 36

A higher number of terminals allows for versatile connectivity options, enhancing compatibility with various designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style facilitates effective heat dissipation, crucial for maintaining performance and reliability under load.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

Operating from -40 °C enables functionality in extreme conditions, broadening the applications of the product.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and prevents corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and improved noise performance in circuit designs.

Maximum Seated Height: 3.41 mm

The low profile height is advantageous for space-constrained applications, facilitating thinner device designs.

Width: 11 mm

Compact width enables the amplifier to fit in tight spaces without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds aids in effective soldering during assembly, ensuring strong connections.

Peak Reflow Temperature °C: 245

The high reflow temperature supports various soldering processes, enhancing manufacturing compatibility.

Length: 15.9 mm

The compact length further enhances the amplifier's suitability for small electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade supports reliable operation in a wide array of environments and applications.

No. of Channels: 4

Having four channels allows for flexibility in audio configurations, able to support multi-channel audio setups.

Technology: BCDMOS

The BCDMOS technology combines high efficiency with high performance, reducing power consumption without sacrificing output quality.

Terminal Form: GULL WING

Gull wing terminals facilitate automated soldering processes and ensure robust mechanical connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for high-density PCB designs, optimizing space without compromising connections.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates manageable moisture sensitivity, facilitating easier handling and assembly.

Technical Specifications

Audio & Video Amplifiers TDA7801PD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.41 mm

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

TDA7801PD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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