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TDA7577BLV

STMicroelectronics

TDA7577BLV by STMicroelectronics

TDA7577BLV by STMicroelectronics is a 2-channel audio amplifier with 78W output power and 0.3% harmonic distortion. It operates b/w -40 °C to 105°C, suitable for automotive audio systems due to its rectangular package style and flange mount design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,017 parts In-Stock

1+ parts

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6,017

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Anansix

USA . 2,035 parts In-Stock

1+ parts

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2,035

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Digiode

USA . 1,229 parts In-Stock

1+ parts

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1,229

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 655 parts In-Stock

1+ parts

$3.204

100+ parts

-

1k+ parts

$2.884

10k+ parts

-

655

$3.204

-

$2.884

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MKK Technologies

India . 748 parts In-Stock

1+ parts

$6.026

100+ parts

-

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748

$6.026

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DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$6.026

100+ parts

-

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748

$6.026

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$15.500

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483

$15.500

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Microchip USA

USA . 1,290 parts In-Stock

1+ parts

$20.758

100+ parts

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1,290

$20.758

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Corphita

USA . 1,343 parts In-Stock

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1,343

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Parana Technologies

USA . 570 parts In-Stock

1+ parts

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100+ parts

$3.831

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570

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$3.831

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Overview

Elevate your audio experience with the TDA7577BLV by STMicroelectronics. Designed with precision and expertise, this audio amplifier delivers unparalleled sound quality and performance. Ideal for a wide range of applications in the audio and video industry, this product offers a nominal output power of 78W and low harmonic distortion of just 0.3%. With a compact design and wide operating temperature range, the TDA7577BLV provides unmatched value and benefits to customers looking for high-quality audio solutions. Experience superior sound with STMicroelectronics.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy installation and integration into a variety of audio equipment.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification purposes, ensuring superior sound quality and performance.

Harmonic Distortion: 0.3 %

Low harmonic distortion of only 0.3% helps maintain the integrity of the audio signal and reduces interference.

No. of Terminals: 27

Plenty of terminals for connecting input and output devices, providing versatility in audio setup configurations.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even under demanding conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in various environments and climates.

Nominal Output Power: 78 W

High nominal output power of 78W delivers strong audio performance with ample volume.

Width: 4.5 mm

Compact width of 4.5mm saves space and facilitates easy integration into audio systems.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage requirement of 6V makes this amplifier suitable for a wide range of power sources.

Nominal Bandwidth: 0.022 kHz

Wide nominal bandwidth of 0.022kHz ensures accurate reproduction of audio frequencies across the spectrum.

Terminal Pitch: 1 mm

Close terminal pitch of 1mm allows for compact layout and efficient connection of components.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage of 18V provides ample headroom for powerful audio output without distortion.

Technical Specifications

Audio & Video Amplifiers TDA7577BLV attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

.3 %

JESD-30 Code:

R-XZFM-T27

Length:

29.23 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

78 W

Package Body Material:

UNSPECIFIED

Package Code:

ZFM

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

19.37 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.5 mm

Trade Compliance

TDA7577BLV General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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