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TDA7564BPDTR

STMicroelectronics

TDA7564BPDTR by STMicroelectronics

TDA7564BPDTR from STMicroelectronics is a Class AB audio amplifier with 50W output power and 4 channels. It operates b/w 8V to 18V, featuring a harmonic distortion of just 10%. Ideal for compact audio applications, it comes in a small outline package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,697 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,697

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Digiode

USA . 2,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,835

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Anansix

USA . 563 parts In-Stock

1+ parts

-

100+ parts

-

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563

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 733 parts In-Stock

1+ parts

$1.212

100+ parts

-

1k+ parts

$1.090

10k+ parts

-

733

$1.212

-

$1.090

-

MKK Technologies

India . 1,161 parts In-Stock

1+ parts

$2.278

100+ parts

-

1k+ parts

-

10k+ parts

-

1,161

$2.278

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DigiPath Technology Company

USA . 1,161 parts In-Stock

1+ parts

$2.278

100+ parts

-

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1,161

$2.278

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Microchip USA

USA . 2,368 parts In-Stock

1+ parts

$3.697

100+ parts

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2,368

$3.697

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Ampacity Inc.

Singapore . 1,512 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,512

$3.800

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-

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AZTECH Wire

Italy . 839 parts In-Stock

1+ parts

$12.490

100+ parts

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839

$12.490

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Corphita

USA . 3,554 parts In-Stock

1+ parts

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3,554

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Parana Technologies

USA . 184 parts In-Stock

1+ parts

-

100+ parts

$1.449

1k+ parts

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184

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$1.449

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Overview

Elevate your audio experience with the TDA7564BPDTR from STMicroelectronics, a leader in innovative technology. This Class AB audio amplifier delivers exceptional sound quality and powerful performance for automotive and home audio applications. With its compact design and reliable construction, it ensures seamless integration while minimizing distortion. Trust STMicroelectronics for top-tier reliability and enjoy crisp, immersive audio that transforms every listening session into a concert-like experience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the amplifier reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration onto PCBs, saving space and improving overall design flexibility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space, making it suitable for compact designs and allowing easier layout on circuit boards.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers provide a good balance between sound quality and power efficiency, making them ideal for high-fidelity audio applications.

Harmonic Distortion: 10 %

A low level of harmonic distortion ensures high-quality audio output, enhancing the listening experience.

Power Supplies (V): 14.4

Operating at 14.4V allows for efficient power handling and potential for high output in audio applications.

No. of Terminals: 36

With 36 terminals, the amplifier can support complex configurations and multiple connections, increasing its versatility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style is space-efficient and optimized for heat dissipation, which is crucial for maintaining performance in high-power applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and oxidation resistance, ensuring reliable connections in various operating conditions.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and simplifies routing on PCBs.

Nominal Output Power: 50 W

A nominal output power of 50W enables the amplifier to drive a wide range of speakers, making it suitable for both personal and professional audio systems.

Maximum Seated Height: 3.41 mm

A low maximum seated height aids in maintaining a low profile in compact audio systems.

Width: 11 mm

Its narrow width allows for greater design versatility, fitting easily into tight spaces.

Minimum Supply Voltage (Vsup): 8 V

With a minimum supply voltage of 8V, the amplifier is flexible in terms of power supply options, accommodating a broader range of applications.

Length: 15.9 mm

Short length aids in conserving board space, allowing for a compact design in audio equipment.

No. of Channels: 4

Having 4 channels allows for multi-channel audio configurations, suitable for surround sound systems.

Technology: BCDMOS

BCD technology provides better performance and reliability, ensuring efficient operation and sound quality.

Nominal Bandwidth: 0.022 kHz

A nominal bandwidth of 0.022 kHz supports a wide range of audio frequencies, ensuring clear sound reproduction.

Terminal Form: GULL WING

Gull wing leads allow for better solder joint strength and easier assembly on circuit boards.

Maximum Supply Current: 300 mA

A maximum supply current of 300 mA indicates the amplifier can deliver sufficient power without overheating.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a compact footprint, which is essential for dense PCB layouts.

Gain: 26 dB

High gain of 26 dB enables the amplifier to amplify low-level signals effectively, improving audio performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the product is suitable for standard soldering processes, ensuring longevity and reliability.

Maximum Supply Voltage (Vsup): 18 V

The capability of handling a maximum supply voltage of 18V allows for high power applications, providing versatility in diverse audio settings.

Technical Specifications

Audio & Video Amplifiers TDA7564BPDTR attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.41 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

TDA7564BPDTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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