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TDA7564BPD

STMicroelectronics

TDA7564BPD by STMicroelectronics

TDA7564BPD by STMicroelectronics is a Class AB audio amplifier with 50W output power, operating b/w 8V and 18V. It features low harmonic distortion at 10% and supports four channels. Ideal for automotive audio systems, it ensures high-quality sound in compact designs.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,038 parts In-Stock

1+ parts

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3,038

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Vyrian

USA . 2,619 parts In-Stock

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2,619

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Anansix

USA . 641 parts In-Stock

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641

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 820 parts In-Stock

1+ parts

$2.403

100+ parts

-

1k+ parts

$2.163

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-

820

$2.403

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$2.163

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MKK Technologies

India . 1,902 parts In-Stock

1+ parts

$4.519

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-

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1,902

$4.519

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DigiPath Technology Company

USA . 1,902 parts In-Stock

1+ parts

$4.519

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1,902

$4.519

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Microchip USA

USA . 2,181 parts In-Stock

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$5.062

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2,181

$5.062

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Ampacity Inc.

Singapore . 638 parts In-Stock

1+ parts

$14.800

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638

$14.800

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AZTECH Wire

Italy . 207 parts In-Stock

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$16.540

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207

$16.540

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Component Stockers USA

USA . 316 parts In-Stock

1+ parts

$99.990

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316

$99.990

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 4,818 parts In-Stock

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4,818

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Parana Technologies

USA . 1,988 parts In-Stock

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$2.873

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1,988

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$2.873

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Overview

Elevate your audio experience with the TDA7564BPD from STMicroelectronics, a trusted leader in innovation. This Class AB amplifier delivers stunning sound quality and reliability, perfect for automotive and home audio applications. Enjoy powerful performance with minimal distortion, allowing you to truly feel every note. With compact design and effortless integration, the TDA7564BPD ensures that your audio system not only sounds great but also fits seamlessly into any setup. Choose excellence, choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides impact resistance and helps in thermal management, making it durable and reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for a compact design, enabling efficient use of board space in modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout for better thermal performance and signal integrity, essential for high-fidelity audio applications.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers are known for their efficiency and low distortion, making them suitable for delivering high-quality audio output.

Harmonic Distortion: 10%

With harmonic distortion at 10%, this amplifier offers good sound quality, ensuring an enjoyable listening experience without introducing significant audio artifacts.

Power Supplies (V): 14.4

Operating at a nominal power supply of 14.4V strikes a balance between adequate amplification and energy efficiency.

No. of Terminals: 36

Having 36 terminals facilitates versatile connectivity options, enabling complex designs and enhanced functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package with heat sink/slugs contributes to excellent thermal management, allowing for efficient heat dissipation during operation.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and provides good corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal position allows for flexible layout options on circuit boards, enhancing design efficiency and adaptability.

Nominal Output Power: 50 W

With a nominal output power of 50W, this amplifier is capable of driving a variety of speakers, making it suitable for various audio applications.

Maximum Seated Height: 3.41 mm

A maximum seated height of 3.41mm allows for low-profile designs, which is beneficial for compact systems.

Width: 11 mm

The compact width of 11mm contributes to space-saving designs, making this amplifier ideal for portable and integrated applications.

Minimum Supply Voltage (Vsup): 8 V

A minimum supply voltage of 8V allows for flexibility in power source choices, accommodating a wide range of applications.

Length: 15.9 mm

The length of 15.9mm keeps the footprint small, further enabling its use in size-constrained electronic designs.

No. of Channels: 4

With 4 channels, this amplifier can support multi-channel audio systems, enhancing the listening experience with surround sound capability.

Technology: BCDMOS

BCD technology combines bipolar, CMOS, and DMOS processes, providing high performance and efficiency in power management.

Nominal Bandwidth: 0.022 kHz

A nominal bandwidth of 0.022 kHz indicates capability for handling a wide range of audio frequencies, ensuring fidelity in sound reproduction.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and solderability, ensuring stable connections for reliable operation.

Maximum Supply Current: 300 mA

A maximum supply current of 300 mA allows for sufficient power delivery while maintaining efficiency, essential for battery-operated devices.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this amplifier can fit into tighter spaces on a PCB, enabling more compact designs.

Gain: 26 dB

A gain of 26 dB signifies strong amplification capability, enhancing audio signals to a robust level without distortion.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity, allowing for controlled handling and storage conditions to ensure reliability.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this product can operate efficiently in various high-performance audio settings.

Technical Specifications

Audio & Video Amplifiers TDA7564BPD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.41 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

TDA7564BPD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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