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TDA7563PD

STMicroelectronics

TDA7563PD by STMicroelectronics

TDA7563PD by STMicroelectronics is a compact audio amplifier with 4 channels, delivering 46 W output power and 30 dB gain. It features low harmonic distortion at 10% and operates b/w 8-18 V supply voltage. Ideal for automotive audio applications, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,656 parts In-Stock

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4,656

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Digiode

USA . 4,413 parts In-Stock

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4,413

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Anansix

USA . 244 parts In-Stock

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244

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,121 parts In-Stock

1+ parts

$1.692

100+ parts

-

1k+ parts

$1.523

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1,121

$1.692

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$1.523

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MKK Technologies

India . 1,027 parts In-Stock

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$3.181

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1,027

$3.181

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DigiPath Technology Company

USA . 1,027 parts In-Stock

1+ parts

$3.181

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1,027

$3.181

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AZTECH Wire

Italy . 824 parts In-Stock

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$17.090

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824

$17.090

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Microchip USA

USA . 267 parts In-Stock

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$32.686

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267

$32.686

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QUARKTWIN TECHNOLOGY LTD

USA . 12,935 parts In-Stock

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Parana Technologies

USA . 1,925 parts In-Stock

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$2.023

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1,925

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$2.023

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Corphita

USA . 1,016 parts In-Stock

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1,016

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Overview

Elevate your audio experience with the TDA7563PD from STMicroelectronics, a leader in innovative technology. This compact, high-performance audio amplifier delivers rich sound quality with impressive power, perfect for automotive and consumer electronics applications. Enjoy the advantages of reduced harmonic distortion and efficient design that ensures reliability and longevity. With STMicroelectronics’ commitment to excellence, you’ll gain unmatched value and performance for your audio needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent insulation and protection from environmental factors, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for modern PCB applications with limited space.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the motherboard and allows for easier integration into various designs.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed to enhance audio signal quality, making it ideal for high-fidelity audio applications.

Harmonic Distortion: 10 %

A harmonic distortion rate of 10% indicates reasonable sound quality, suitable for general audio applications.

No. of Terminals: 36

Having 36 terminals provides flexibility in design and connections, allowing for better integration with various audio systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style supports efficient thermal management and minimized size, making it suitable for space-constrained designs.

Terminal Position: DUAL

Dual terminal positioning aids in stability during assembly and enhances connectivity options.

Nominal Output Power: 46 W

With a nominal output power of 46 W, this amplifier can easily drive most speakers, providing ample power for a robust audio experience.

Maximum Seated Height: 3.43 mm

The low seated height ensures that this amplifier can fit into compact chassis designs without compromising performance.

Width: 11 mm

A compact width of 11 mm allows for flexible PCB design without taking up excessive board space.

Minimum Supply Voltage (Vsup): 8 V

The ability to operate at a minimum voltage of 8 V expands its usability across a variety of devices and applications.

Length: 15.9 mm

The compact length facilitates the integration of the amplifier into tighter layouts and advanced electronic designs.

No. of Channels: 4

With four channels, this amplifier enables multi-channel audio setups, enhancing the overall sound experience.

Technology: BCDMOS

Using BCDMOS technology enhances performance and efficiency, contributing to reduced noise and improved audio fidelity.

Nominal Bandwidth: 0.022 kHz

This bandwidth ensures clear reproduction of low-frequency sounds, critical for high-quality music and audio playback.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and provides better mechanical strength, crucial for assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for high-density layouts, allowing for more efficient use of PCB space.

Gain: 30 dB

A gain of 30 dB allows for significant amplification of audio signals, making it effective for a wide range of audio tasks.

Maximum Supply Voltage (Vsup): 18 V

The capability to handle a maximum supply voltage of 18 V offers versatility in power supply options, accommodating various applications.

Technical Specifications

Audio & Video Amplifiers TDA7563PD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

46 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

TDA7563PD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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