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TDA7563BH

STMicroelectronics

TDA7563BH by STMicroelectronics

STMicroelectronics TDA7563BH is a Class AB audio amplifier with 4 channels, delivering 50W nominal output power. It operates on a supply voltage range of 8-18V and features low harmonic distortion at 10%. Ideal for automotive audio systems due to its high gain (30dB) and wide bandwidth (0.022 kHz).

Median Price

$10.355

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,568 parts In-Stock

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$10.355

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1,568

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Vyrian

USA . 7,164 parts In-Stock

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Anansix

USA . 2,211 parts In-Stock

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2,211

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Atlantic Semiconductor

USA . 699 parts In-Stock

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699

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ComSIT Distribution GmbH

Germany . 510 parts In-Stock

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510

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Lakeland Logistics Inc

USA . 306 parts In-Stock

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Bristol Electronics

USA . 17 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,975 parts In-Stock

1+ parts

$1.593

100+ parts

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$1.434

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1,975

$1.593

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$1.434

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MKK Technologies

India . 2,246 parts In-Stock

1+ parts

$2.996

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2,246

$2.996

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DigiPath Technology Company

USA . 2,246 parts In-Stock

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$2.996

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2,246

$2.996

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Corphita

USA . 2,317 parts In-Stock

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$9.810

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2,317

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QUARKTWIN TECHNOLOGY LTD

USA . 9,192 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,300 parts In-Stock

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Lixinc

USA . 2,985 parts In-Stock

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Metaverse IC Inc.

Canada . 1,785 parts In-Stock

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Assy Fe

Spain . 1,785 parts In-Stock

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Parana Technologies

USA . 493 parts In-Stock

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$1.905

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493

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$1.905

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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400

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GreenTree Electronics

Israel . 323 parts In-Stock

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323

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Eastek

USA . 289 parts In-Stock

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Glotronic Ltd.

UK . 46 parts In-Stock

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Overview

Elevate your audio experience with the TDA7563BH from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers top-notch audio & video amplifiers that guarantee superior performance. With a nominal output power of 50W and a harmonic distortion of only 10%, this Class AB audio amplifier is perfect for various applications. From car stereos to home entertainment systems, the TDA7563BH offers unmatched value, delivering clear and powerful sound that will enhance any listening experience. Upgrade your audio setup today with the TDA7563BH and enjoy the benefits of cutting-edge technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers offer a good balance between efficiency and sound quality.

Harmonic Distortion: 10 %

Low harmonic distortion ensures clear audio output with minimal interference.

Power Supplies (V): 14.4

Suitable power supply voltage for optimal performance.

No. of Terminals: 27

Sufficient terminals for versatile connectivity options.

Nominal Output Power: 50 W

Delivers strong audio output for immersive sound experience.

Technology: BCDMOS

Uses advanced BCDMOS technology for efficient power handling.

Nominal Bandwidth: 0.022 kHz

Wide bandwidth for reproducing a broad range of frequencies accurately.

Gain: 30 dB

A high gain value amplifies the audio signal effectively.

Technical Specifications

Audio & Video Amplifiers TDA7563BH attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PZFM-T27

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

27

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27H,.14,.7,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TDA7563BH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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