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TDA75610S-ZSX

STMicroelectronics

TDA75610S-ZSX by STMicroelectronics

TDA75610S-ZSX by STMicroelectronics is a 4-channel audio amplifier with a nominal output power of 68W and harmonic distortion of 0.15%. It operates b/w -40 to 105 °C, suitable for automotive audio systems due to its BCDMOS technology and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,535 parts In-Stock

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5,535

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Digiode

USA . 2,838 parts In-Stock

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Anansix

USA . 906 parts In-Stock

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906

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IDEA Electronic Components Group

UK . 660 parts In-Stock

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$3.477

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$3.129

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660

$3.477

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$3.129

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MKK Technologies

India . 2,260 parts In-Stock

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$6.538

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$6.538

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DigiPath Technology Company

USA . 2,260 parts In-Stock

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$6.538

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2,260

$6.538

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AZTECH Wire

Italy . 583 parts In-Stock

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$18.970

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583

$18.970

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Component Stockers USA

USA . 631 parts In-Stock

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$81.020

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631

$81.020

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 3,007 parts In-Stock

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Corphita

USA . 692 parts In-Stock

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Parana Technologies

USA . 375 parts In-Stock

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$4.157

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375

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ChipstoGo Electronic ltd

UK . 294 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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Overview

Experience superior audio quality with the TDA75610S-ZSX by STMicroelectronics, a leading manufacturer in the audio & video amplifiers category. This compact and powerful audio amplifier delivers crystal-clear sound with minimal distortion, making it ideal for a wide range of applications. With 4 channels and a nominal output power of 68W, this amplifier provides exceptional value and performance for all your audio needs. Trust STMicroelectronics to enhance your audio experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the amplifier lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and PCB assembly, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient PCB layout and space utilization.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, ensuring optimized performance for sound amplification.

Harmonic Distortion: 0.15%

Low harmonic distortion of 0.15% results in clear and high-quality audio output without unwanted noise.

No. of Terminals: 36

Having 36 terminals provides flexibility in connectivity options and allows for versatile usage.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The package style with heat sink/slug enhances heat dissipation, ensuring optimal performance even under high loads.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, the amplifier can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C to 105°C makes the amplifier suitable for use in various environments.

Nominal Output Power: 68 W

The high nominal output power of 68W ensures ample power for driving speakers and delivering robust audio output.

Maximum Seated Height: 3.41 mm

The compact maximum seated height helps in space-constrained applications and compact system designs.

Width: 11 mm

The narrow width of 11mm contributes to a space-efficient design and easy integration in different setups.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage requirement of 6V makes the amplifier suitable for use with a wide range of power sources.

Length: 15.7 mm

The length of 15.7mm provides a balanced form factor for the amplifier, enabling easy placement on PCBs.

No. of Channels: 4

Having 4 channels allows for multi-speaker setups or individual control of different audio sources, enhancing audio customization.

Technology: BCDMOS

The use of BCDMOS technology ensures efficient power handling, low noise, and high reliability in audio amplification.

Nominal Bandwidth: 0.022 kHz

The nominal bandwidth of 0.022 kHz supports a wide range of audio frequencies, delivering accurate sound reproduction.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and connection, ensuring reliable electrical connections.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for high-density mounting on PCBs, saving space and enabling compact designs.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage capability of 18V ensures compatibility with a wide range of power sources and system requirements.

Technical Specifications

Audio & Video Amplifiers TDA75610S-ZSX attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

.15 %

JESD-30 Code:

R-PDSO-G36

Length:

15.7 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

68 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.55

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.41 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11 mm

Trade Compliance

TDA75610S-ZSX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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