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TDA7498L

STMicroelectronics

TDA7498L by STMicroelectronics

TDA7498L by STMicroelectronics is a dual-function audio amplifier with 32V power supply, 36 terminals, and 60mA max supply current. It operates b/w -20 °C to 85°C, in a small outline package suitable for audio and video amplification applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,200 parts In-Stock

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6,200

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Anansix

USA . 2,052 parts In-Stock

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2,052

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Digiode

USA . 417 parts In-Stock

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417

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,450 parts In-Stock

1+ parts

$1.267

100+ parts

-

1k+ parts

$1.140

10k+ parts

-

1,450

$1.267

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$1.140

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MKK Technologies

India . 468 parts In-Stock

1+ parts

$2.382

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-

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468

$2.382

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DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$2.382

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468

$2.382

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Microchip USA

USA . 155 parts In-Stock

1+ parts

$7.011

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155

$7.011

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AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$19.080

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715

$19.080

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QUARKTWIN TECHNOLOGY LTD

USA . 20,536 parts In-Stock

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20,536

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A-Z Elektronik GmbH

Germany . 7,112 parts In-Stock

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7,112

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Corphita

USA . 4,235 parts In-Stock

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4,235

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,387 parts In-Stock

1+ parts

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100+ parts

$1.515

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1,387

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$1.515

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

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1,100

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Perfect Parts

USA . 68 parts In-Stock

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68

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Overview

Experience superior audio quality and performance with the TDA7498L by STMicroelectronics, a leading manufacturer in the industry. This audio amplifier offers unparalleled value and benefits, making it ideal for a wide range of applications in the Audio & Video Amplifiers category. With its cutting-edge technology and reliable construction, the TDA7498L is designed to enhance your audio experience like never before. Upgrade your sound system today and enjoy crystal-clear sound with this top-of-the-line product from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into various electronic devices.

No. of Functions: 2

Having 2 functions in one device offers flexibility and efficiency in audio amplification.

Package Shape: RECTANGULAR

Rectangular package shape enables space-saving installation in tight spaces.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Power Supplies (V): 32

Supports a power supply voltage of 32V, suitable for a wide range of audio devices.

No. of Terminals: 36

36 terminals provide ample connectivity options for various audio input and output connections.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline package style with shrink pitch design offers compact size and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in different environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality even in cold temperatures.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides corrosion resistance and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and wiring configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe assembly during the reflow process without damaging the device.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperature for reliable soldering in the assembly process.

Terminal Form: GULL WING

Gull wing terminal form enables easy placement and soldering on circuit boards.

Maximum Supply Current: 60 mA

Supports a maximum supply current of 60mA for stable and efficient operation.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5mm allows for precise connections and reduces the risk of short circuits.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Technical Specifications

Audio & Video Amplifiers TDA7498L attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

32

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

60 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TDA7498L General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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