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TDA7493

STMicroelectronics

TDA7493 by STMicroelectronics

TDA7493 by STMicroelectronics is a compact audio amplifier with 2 channels, delivering 3 W output power and a gain of 18 dB. It operates on supply voltages from 3 to 5.5 V and features low harmonic distortion at 10%. Ideal for space-constrained audio applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,554 parts In-Stock

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6,554

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Digiode

USA . 2,853 parts In-Stock

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2,853

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Anansix

USA . 1,179 parts In-Stock

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1,179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.349

100+ parts

$0.318

1k+ parts

$0.286

10k+ parts

-

2,500

$0.349

$0.318

$0.286

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IDEA Electronic Components Group

UK . 927 parts In-Stock

1+ parts

$0.823

100+ parts

-

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$0.741

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-

927

$0.823

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$0.741

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MKK Technologies

India . 548 parts In-Stock

1+ parts

$1.548

100+ parts

-

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548

$1.548

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DigiPath Technology Company

USA . 548 parts In-Stock

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$1.548

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548

$1.548

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Microchip USA

USA . 223 parts In-Stock

1+ parts

$7.445

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223

$7.445

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AZTECH Wire

Italy . 129 parts In-Stock

1+ parts

$15.620

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129

$15.620

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A-Z Elektronik GmbH

Germany . 6,861 parts In-Stock

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6,861

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Parana Technologies

USA . 1,610 parts In-Stock

1+ parts

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$0.984

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1,610

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$0.984

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Corphita

USA . 1,610 parts In-Stock

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1,610

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Kepictronics

USA . 1,460 parts In-Stock

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1,460

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Overview

Experience audio excellence with the TDA7493 from STMicroelectronics, a trusted name in innovation. This compact amplifier brings your sound to life, delivering rich, distortion-free audio across various applications—from sleek portable speakers to sophisticated home systems. Enjoy the benefit of its efficient design and superior performance, ensuring you get the most out of your audio experience while enhancing device longevity and reliability. Elevate your sound today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reduces overall weight, making it suitable for portable audio applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, which is ideal for modern audio equipment.

Package Shape: RECTANGULAR

Rectangular shape optimizes space on PCBs, facilitating efficient layout and integration in various audio devices.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, ensuring high-quality sound reproduction in a variety of environments.

Harmonic Distortion: 10 %

A distortion level of 10% is acceptable for many consumer audio applications, maintaining clarity and fidelity in sound outputs.

Power Supplies (V): 3/5

Compatible with multiple power supply levels (3V to 5V), ensuring flexibility for various device requirements.

No. of Terminals: 24

With 24 terminals, the amplifier supports complex connections necessary for modern audio processing needs.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style allows for effective heat dissipation while maintaining a slim and compact design, perfect for space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable functionality in a range of ambient conditions, enhancing product durability.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the amplifier is suitable for a wide range of applications, even in colder environments.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB layouts and better integration with other components.

Nominal Output Power: 3 W

With 3W of output power, the amplifier is capable of driving small speakers effectively, making it a great choice for portable and compact audio systems.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm is advantageous for thin-profile designs, particularly in portable devices.

Width: 4.4 mm

Compact width allows for high-density mounting on circuit boards, optimizing space usage.

Minimum Supply Voltage (Vsup): 3 V

Starts functioning effectively at a low voltage of 3V, making it energy-efficient and suitable for battery-powered devices.

Length: 7.8 mm

A relatively short length reduces the footprint, facilitating easier integration into small electronic products.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, ensuring reliability for everyday consumer applications.

No. of Channels: 2

Dual-channel design provides capabilities for stereo sound, enhancing audio experiences in various setups.

Nominal Bandwidth: 0.022 kHz

A nominal bandwidth of 0.022 kHz allows for a broad range of audio signals, ensuring versatility in different audio applications.

Terminal Form: GULL WING

Gull wing terminal formation aids easy soldering and assembly, facilitating smoother manufacturing processes.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for compact layouts while maintaining electrical performance, ideal for modern electronic designs.

Gain: 18 dB

A gain of 18 dB is robust enough for amplifying weak audio signals, delivering clear sound output.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate at a maximum supply voltage of 5.5V provides flexibility for integration into more powerful systems without risk of damage.

Technical Specifications

Audio & Video Amplifiers TDA7493 attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

18 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TDA7493 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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