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TDA7400DTR

STMicroelectronics

TDA7400DTR by STMicroelectronics

TDA7400DTR by STMicroelectronics is a versatile audio signal processor designed for automotive applications. It features 2 channels, operates at 7.5V-10V, and interfaces via I2C. With a wide temp range of -40 °C to 85 °C, it's ideal for reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,677 parts In-Stock

1+ parts

-

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1k+ parts

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4,677

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Digiode

USA . 4,506 parts In-Stock

1+ parts

-

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1k+ parts

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4,506

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Anansix

USA . 2,287 parts In-Stock

1+ parts

-

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2,287

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1k+ parts

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 257 parts In-Stock

1+ parts

$9.647

100+ parts

-

1k+ parts

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10k+ parts

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257

$9.647

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AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$16.280

100+ parts

-

1k+ parts

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372

$16.280

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A-Z Elektronik GmbH

Germany . 5,124 parts In-Stock

1+ parts

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5,124

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Kepictronics

USA . 1,945 parts In-Stock

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1,945

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Corphita

USA . 1,857 parts In-Stock

1+ parts

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1,857

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IDEA Electronic Components Group

UK . 1,747 parts In-Stock

1+ parts

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1,747

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MKK Technologies

India . 1,594 parts In-Stock

1+ parts

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1,594

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

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1,594

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Parana Technologies

USA . 1,501 parts In-Stock

1+ parts

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1,501

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Perfect Parts

USA . 831 parts In-Stock

1+ parts

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831

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Overview

Elevate your audio projects with the TDA7400DTR from STMicroelectronics, renowned for its commitment to quality and innovation. This versatile audio signal processor enhances sound clarity across diverse applications, making it ideal for automotive systems and consumer electronics. With a robust design and excellent thermal performance, experience reliable audio processing that meets the highest industry standards. Transform your sound experience—choose TDA7400DTR for unmatched performance!

Feature Benefit Bullets

Other Names: 497-3977-1, 497-3977-2

Having multiple part numbers ensures compatibility and easier sourcing from different suppliers.

Standard Package: 1,000

A large standard package quantity makes this product economical for bulk purchases, suitable for large-scale applications.

Category: Integrated Circuits (ICs), Audio Special Purpose

Specialized in audio applications, this IC is optimized for high performance in audio processing tasks.

Packaging: Tape & Reel (TR), Cut Tape (CT)

Available in tape and reel ensures easy automated handling and assembly in manufacturing processes.

Function: Audio Signal Processor

Designed specifically for audio processing, providing high fidelity sound reproduction and processing capabilities.

Applications: Audio

Ideal for audio applications, promoting integration into diverse audio-related products.

Number of Channels: 2

The dual-channel architecture allows for stereo audio processing, enhancing user experience in audio systems.

Interface: I2C

Using the I2C interface simplifies communication with microcontrollers and other devices, making integration easier.

Voltage - Supply: 7.5V ~ 10V

The flexible supply voltage range allows for compatibility with various power supply systems in audio equipment.

Operating Temperature: -40 °C ~ 85 °C (TA)

This wide operating temperature range makes the product suitable for automotive and harsh environment applications.

Mounting Type: Surface Mount

Surface mount technology reduces board space and improves assembly efficiency, ideal for compact designs.

Grade: Automotive

Automotive-grade components ensure reliability under challenging conditions, making it suitable for vehicle applications.

Package / Case: 28-SOIC (0.295", 7.50mm Width)

The 28-SOIC package allows for easy mounting and fits well on standard PCB layouts, ensuring design flexibility.

Supplier Device Package: 28-SO

Availability in a specific package type ensures compatibility with various PCB designs and layouts.

Base Product Number: TDA7400

Referencing a well-known base product number helps in identifying an industry-standard component for audio applications.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

An MSL of 1 indicates no special handling requirements, simplifying storage and assembly processes.

Technical Specifications

Additional Parts TDA7400DTR attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

497-3977-1
497-3977-2
-497-3977-1
-497-3977-2

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Audio Special Purpose

Applications:

Audio

Grade:

Automotive

Mounting Type:

Surface Mount

Supplier Device Package:

28-SO

Standard Package:

1,000

Function:

Audio Signal Processor

Number of Channels:

2

Package / Case:

28-SOIC (0.295", 7.50mm Width)

Voltage - Supply:

7.5V ~ 10V

Packaging:

Tape & Reel (TR)
Cut Tape (CT)

Interface:

I2C

Base Product Number:

TDA7400

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TDA7400DTR Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.31.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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