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TDA7391PD13TR

STMicroelectronics

TDA7391PD13TR by STMicroelectronics

TDA7391PD13TR by STMicroelectronics is a compact audio amplifier with a nominal output power of 32 W and operates b/w 8-18 V. It features low harmonic distortion at 10% and a gain of 30 dB, making it ideal for high-quality audio applications. Its small outline design ensures efficient heat dissipation in various electronic devices.

Median Price

$1.882

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,871 parts In-Stock

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3,871

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Digiode

USA . 2,119 parts In-Stock

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2,119

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Anansix

USA . 1,502 parts In-Stock

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1,502

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Bristol Electronics

USA . 170 parts In-Stock

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$1.882

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$1.747

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170

-

$1.882

$1.747

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Microfarads

USA . 164 parts In-Stock

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164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,211 parts In-Stock

1+ parts

$3.534

100+ parts

-

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$3.180

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2,211

$3.534

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$3.180

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MKK Technologies

India . 1,657 parts In-Stock

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$6.645

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1,657

$6.645

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DigiPath Technology Company

USA . 1,657 parts In-Stock

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$6.645

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1,657

$6.645

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AZTECH Wire

Italy . 190 parts In-Stock

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$11.040

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190

$11.040

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Microchip USA

USA . 317 parts In-Stock

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$12.479

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317

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QUARKTWIN TECHNOLOGY LTD

USA . 13,676 parts In-Stock

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Corphita

USA . 4,829 parts In-Stock

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4,829

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Parana Technologies

USA . 2,116 parts In-Stock

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$4.225

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$4.225

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Overview

Elevate your audio experience with the TDA7391PD13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This premium audio amplifier delivers remarkable sound quality, ensuring every note resonates clearly. Its compact design fits seamlessly into various applications, from automotive to home audio systems, providing 32W of robust power. With STMicroelectronics' commitment to excellence, you gain reliability and performance for an unbeatable auditory journey.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making this amplifier suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCB, allowing for more efficient layouts.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, ensuring high fidelity and performance in sound reproduction.

Harmonic Distortion: 10 %

With a harmonic distortion level of 10%, this amplifier offers a balanced sound quality suitable for various audio setups.

Power Supplies (V): 14.4

Operates at a nominal voltage of 14.4V, which is commonly used in automotive and portable audio applications.

No. of Terminals: 20

A greater number of terminals allows for more complex circuitry and better connectivity options in designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package with heat sink capability enhances thermal management, improving reliability and performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and corrosion resistance, ensuring long-lasting connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options, accommodating various design requirements.

Nominal Output Power: 32 W

A nominal output power of 32W is adequate for driving speakers in home audio systems and portable devices.

Maximum Seated Height: 3.6 mm

The low seated height contributes to a sleek design, ideal for compact electronic systems.

Width: 11 mm

A narrow width makes it suitable for tight spaces in modern AV equipment, without compromising performance.

Minimum Supply Voltage (Vsup): 8 V

A minimum supply voltage of 8V increases compatibility with a variety of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow temperature time ensures reliability in soldering processes, crucial for high-volume manufacturing.

Peak Reflow Temperature °C: 245

A peak reflow temperature of 245 °C is standard for many lead-free soldering applications, ensuring compatibility with modern soldering techniques.

Length: 15.9 mm

The compact length allows for easy integration into small form factor devices without sacrificing performance.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making it suitable for battery-operated devices.

Nominal Bandwidth: 0.022 kHz

A nominal bandwidth of 0.022 kHz is adequate for audio applications, ensuring dynamic sound performance.

Terminal Form: GULL WING

Gull wing terminals facilitate stable mounting on PCBs, enhancing solder joint reliability.

Maximum Supply Current: 150 mA

The 150 mA maximum supply current indicates energy efficiency, vital for portable and battery-powered applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for denser packing of components, optimizing PCB layout.

Gain: 30 dB

A gain of 30 dB enables effective amplification, suitable for diverse audio systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating provides guidance on handling and storage, ensuring reliability during manufacturing.

Maximum Supply Voltage (Vsup): 18 V

Supporting a maximum supply voltage of 18V widens the range of applications, making it versatile for different environments.

Technical Specifications

Audio & Video Amplifiers TDA7391PD13TR attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Nominal Output Power:

32 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

150 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

TDA7391PD13TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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