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TDA7332

STMicroelectronics

TDA7332 by STMicroelectronics

TDA7332 by STMicroelectronics is an active filter with 14 terminals, operating at -40 to 85 °C. It has a switched capacitor filter type, response as bandpass, and cutoff frequency range of 56.5-57.5 kHz. Ideal for industrial applications requiring a supply voltage of 4.5-5.5V and max current draw of 14mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,686 parts In-Stock

1+ parts

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2,686

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Vyrian

USA . 2,641 parts In-Stock

1+ parts

-

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2,641

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Anansix

USA . 1,329 parts In-Stock

1+ parts

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1,329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,842 parts In-Stock

1+ parts

$11.777

100+ parts

-

1k+ parts

$10.599

10k+ parts

-

1,842

$11.777

-

$10.599

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MKK Technologies

India . 1,941 parts In-Stock

1+ parts

$22.146

100+ parts

-

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10k+ parts

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1,941

$22.146

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DigiPath Technology Company

USA . 1,941 parts In-Stock

1+ parts

$22.146

100+ parts

-

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10k+ parts

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1,941

$22.146

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Corphita

USA . 820 parts In-Stock

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820

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Parana Technologies

USA . 264 parts In-Stock

1+ parts

-

100+ parts

$14.081

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264

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$14.081

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Overview

Unleash the power of high-quality audio filtering with the TDA7332 by STMicroelectronics. Designed for impeccable performance, this active filter boasts exceptional reliability and precision craftsmanship that only a trusted manufacturer like STMicroelectronics can deliver. Perfect for applications in audio processing, communication systems, and instrumentation, the TDA7332 offers unrivaled value by providing efficient signal processing and noise reduction. Elevate your audio experience with the TDA7332 and enjoy unmatched benefits and advantages that cater to all your filtering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for a wide range of applications.

Maximum Supply Current (Isup): 14 mA

Low supply current consumption helps in minimizing power usage, making the product energy-efficient.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic designs and layouts.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filters offer high-performance filtering capabilities, making this product ideal for applications requiring precise filtering.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent and reliable operation of the product.

Poles and Zeros: 8 AND 0

Having 8 poles ensures precise filtering and signal processing, making this product suitable for demanding applications.

Max Center/Cutoff Freq Rng: 57.5 kHz

Wide frequency range allows for filtering a broad range of signals, making this product versatile for different applications.

Response Type: BANDPASS

Bandpass response type enables the product to selectively pass a certain range of frequencies, which is beneficial in applications requiring specific frequency bands.

Technical Specifications

Active Filters TDA7332 attributes and parameters. Explore more Active Filters devices from STMicroelectronics

Electrical Characteristics

Supply Voltage Limit:

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

14 mA

Power Supply:

5 V

Performance Parameters

Response Type:

Filter Technology:

Maximum Frequency - Cutoff or Center:

57.5 kHz

Minimum Frequency - Cutoff or Center:

56.5 kHz

Poles and Zeros:

8 and 0

Filter Order:

8th

Environmental Characteristics

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

14

Terminal Finish:

Matte Tin

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Width:

0.6 in (15.24 mm)

Seated Height Limit:

0.201 in (5.1 mm)

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Additional Features

Qualified:

No

Trade Compliance

TDA7332 Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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