Loading...

STV0119

STMicroelectronics

STV0119 by STMicroelectronics

STV0119 by STMicroelectronics is a compact color signal encoder designed for PAL and NTSC video standards. It features a 28-terminal gull-wing package with a max height of 2.65 mm, ideal for space-constrained applications. This surface-mount device ensures efficient signal conversion in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,397

-

-

-

-

Anansix

USA . 1,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,518

-

-

-

-

Digiode

USA . 1,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,005

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,916 parts In-Stock

1+ parts

$2.453

100+ parts

-

1k+ parts

$2.207

10k+ parts

-

1,916

$2.453

-

$2.207

-

MKK Technologies

India . 974 parts In-Stock

1+ parts

$4.612

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$4.612

-

-

-

DigiPath Technology Company

USA . 974 parts In-Stock

1+ parts

$4.612

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$4.612

-

-

-

Corphita

USA . 3,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,712

-

-

-

-

Parana Technologies

USA . 2,328 parts In-Stock

1+ parts

-

100+ parts

$2.933

1k+ parts

-

10k+ parts

-

2,328

-

$2.933

-

-

Overview

Transform your video experience with the STV0119 from STMicroelectronics, a leader in innovative technology. This versatile color signal encoder seamlessly supports both PAL and NTSC standards, enhancing visual quality for various applications. Designed for compact spaces, its reliable performance ensures crisp, vibrant imagery every time. Trust STMicroelectronics for superior quality and service, elevating your projects with unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures long-lasting performance and reliability, making this converter a dependable choice for various applications.

Surface Mount: YES

Surface mount technology allows for compact design, enabling the converter to fit into smaller devices and improving overall circuit efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, facilitating easier arrangement with other components in tight designs.

General IC Type: COLOR SIGNAL ENCODER

As a color signal encoder, this IC is specifically designed to handle video signals effectively, ensuring high-quality output for visual applications.

No. of Terminals: 28

With 28 terminals, this converter offers ample connectivity options, allowing integration into complex systems with various input and output requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes high-density mounting on circuit boards, ideal for space-constrained environments.

Terminal Position: DUAL

The dual terminal position enhances the design's versatility, accommodating various layout preferences and simplifying routing on PCBs.

Maximum Seated Height: 2.65 mm

At a low maximum seated height, this converter minimizes the component's profile, allowing for slimmer designs and greater integration flexibility.

Video Standard: PAL; NTSC

Support for both PAL and NTSC video standards makes this converter versatile, suitable for global applications and a wide range of multimedia devices.

Width: 7.5 mm

A compact width of 7.5 mm allows for efficient placement on circuit boards, contributing to a streamlined overall design.

Length: 17.9 mm

The manageable length of 17.9 mm ensures easy integration into devices without obstructing adjacent components, enhancing overall design layout.

Terminal Form: GULL WING

Gull wing terminals facilitate effective soldering and provide a stable mechanical connection, ensuring reliability and ease of manufacturing.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between close spacing for reducing footprint and sufficient distance for efficient soldering.

Technical Specifications

Color Signal Converters STV0119 attributes and parameters. Explore more Color Signal Converters devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Video Standard:

PAL; NTSC

Width:

7.5 mm

Trade Compliance

STV0119 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7